conga-TCRP1 Preview image

Your item has been added to the inquiry

conga-TCRP1 Image

conga-TCRP1

AMD RYZEN™ AI Embedded P100 シリーズベースの COM Express® Compact モジュール

Selected product variant

    Selected ecosystem parts

    Virtualization

      Operating Systems

        IOT Software

          Cooling Solutions

            Memory

              Carrierboards

                Module services

                  Value adding ecosystem offerings

                  Virtualization

                  Operating Systems

                  IOT Software

                  Cooling Solutions

                  Memory

                  Carrierboards

                  Module services

                  見積りを依頼 Add more articles

                  conga-TCRP1

                  AMD Ryzen™ AI Embedded P100シリーズ搭載 COM Express® Compact Type 6 モジュール

                  COMについて学ぶ  - 解説書をダウンロード

                  • AMD Zen5/5c CPU コア
                  • AMD Radeon™ RDNA™ 3.5 グラフィックス
                  • AMD XDNA™ 2 NPU
                  • TDP レンジ 15W ～ 54W
                  • オンボード NVMe™ SSD（オプション）
                  Congatec Logo
                  Do you want to add further ecosystem parts (carrier boards, memory,...) to your request?

                  Value adding ecosystem offerings

                  Virtualization

                  Operating Systems

                  IOT Software

                  Cooling Solutions

                  Memory

                  Carrierboards

                  Module services

                  Specification

                  Formfactor
                  COM Express Compact
                  CPU
                  AMD Ryzen™ AI Embedded P185 – 12 x 5.1 GHz, 12 MB cache, 28 W
                  AMD Ryzen™ AI Embedded P174 – 10 x 5 GHz, 8 MB cache, 28 W
                  AMD Ryzen™ AI Embedded P164 – 8 x 5 GHz, 8 MB cache, 28 W
                  AMD Ryzen™ AI Embedded P132 – 6 x 4.5 GHz, 8 MB cache, 28 W
                  AMD Ryzen™ AI Embedded P121 – 4 x 4.4 GHz, 8 MB cache, 28 W
                  AMD Ryzen™ AI Embedded P185i – 12 x 5.1 GHz, 12 MB cache, 28 W
                  AMD Ryzen™ AI Embedded P174i – 10 x 5 GHz, 8 MB cache, 28 W
                  AMD Ryzen™ AI Embedded P164i – 8 x 5 GHz, 8 MB cache, 28 W
                  AMD Ryzen™ AI Embedded P132i – 6 x 4.5 GHz, 8 MB cache, 28 W
                  AMD Ryzen™ AI Embedded P121i – 4 x 4.5 GHz, 8 MB cache, 28 W
                  DRAM
                  2 SODIMM sockets for DDR5 memory modules up to 48 GB each (max. 96 GB RAM system capacity) | up to 5600 MT/s | ECC supported
                  Ethernet
                  2.5 GbE via Intel® i226 Ethernet controller series
                  I/O Interfaces
                  4 x USB 3.2 Gen2
                  4 x USB 2.0
                  2 x SATA 6Gb/s (if NVMe™ SSD option is not used)
                  8 x PCIe Gen4
                  PEG x4 Gen4
                  1 x I²C bus
                  1 x GPSPI
                  2 x UART
                  8 x GPIO
                  1 x SM-Bus
                  1 x LPC
                  Mass storage
                  NVMe™ SSD up to 512 GB capacity (option instead of SATA ports)
                  Graphics
                  Integrated AMD Radeon™ RDNA™ 3.5 Graphics with up to 16x CUs (Compute Units)
                  NPU/AI Acceleration
                  Integrated XDNA 2™ NPU with up to 50 TOPs
                  congatec Board Controller
                  Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection
                  embedded BIOS Features
                  AMI Aptio® UEFI firmware
                  32 Mbyte serial SPI with congatec Embedded BIOS feature
                  OEM Logo
                  OEM CMOS Defaults
                  LCD Control
                  Display Auto Detection
                  Backlight Control
                  Flash Update
                  Security
                  Trusted Platform Module (TPM 2.0)
                  Power Management
                  ACPI 6.0 with battery support
                  Operating Systems
                  Microsoft® Windows 11
                  Microsoft® Windows 11 IoT Enterprise
                  Linux
                  Hypervisor
                  conga-zones Hypervisor
                  Temperature
                  Commercial variants: Operation: 0° to +60°C | Storage: -20° to +80°C
                  Industrial variants: Operation: -40° to +85°C | Storage: -40° to +85°C
                  Humidity
                  Operating: 10 to 85% r. H. non cond. / Storage 5 to 85% r. H. non cond.
                  Video Interfaces
                  Up to 3x DDI
                  LVDS or eDP
                  4 x independent displays
                  Size
                  95 x 95 mm (3,74" x 3,74")

                  Documents

                  All documents found on this page are updated without notification. Always check this page for the latest version.

                  Data Sheet
                  Datasheet conga-TCRP1 19.10.2026
                  Whitepaper
                  The Computer-on-Modules Compendium Download for free and gain the ultimate reference guide to COM technology. From fundamentals to advanced use cases – this compendium helps you design faster, smarter, and more efficiently.

                  Software

                  EFI
                  cgutlcmd_efi_1.7.3.0.zip 08.12.2025 / 516.52 KB
                  congatec System Utility Rev. 1.7.3.0. for EFI shell. Use for BIOS update or customization and panel configuration.
                  Linux
                  CgosPy_1_3.zip 23.07.2024 / 655.40 KB
                  CgosPy is a Python package containing the cgos module which provides ctypes wrapper functions for accessing the CGOS API.
                  CGOS_DIRECT_Lx_R3.2.0.zip 29.07.2026 / 206.49 KB
                  CGOS direct driver for Linux.
                  cgutlcmd_linux_1.7.3.0.zip 08.12.2025 / 322.62 KB
                  congatec System Utility Rev. 1.7.3.0. for Linux. Use for BIOS update or customization and panel configuration. Important note: Only compatible with cgos direct version minimum 3.1.0!
                  cgutlgui_qt_1.7.3.1.zip 20.05.2026 / 57.44 MB
                  Qt based GUI version of the congatec System Utility for Windows and Linux; Rev. 1.7.3.1. supports BIOS Capsule and Firmware update as well as BIOS customization and panel configuration. Provides easy access to all CGOS functions and includes a CGOS based hardware monitor with logging functionality. Important note: Only compatible with cgos direct 3.1.0 and newer!
                  Windows 10
                  CgosPy_1_3.zip 23.07.2024 / 655.40 KB
                  CgosPy is a Python package containing the cgos module which provides ctypes wrapper functions for accessing the CGOS API.
                  CGOS_direct_Win10_Win11_3.2.0.zip 29.07.2026 / 16.54 MB
                  CGOS direct driver for Windows 10 and Windows 11.
                  cgutlcmd_win_1.7.3.0.zip 08.12.2025 / 16.33 MB
                  congatec System Utility Rev. 1.7.3.0. for Windows. Use for BIOS update or customization and panel configuration. Important note: Only compatible with cgos direct version minimum 3.1.0!
                  cgutlgui_qt_1.7.3.1.zip 20.05.2026 / 57.44 MB
                  Qt based GUI version of the congatec System Utility for Windows and Linux; Rev. 1.7.3.1. supports BIOS Capsule and Firmware update as well as BIOS customization and panel configuration. Provides easy access to all CGOS functions and includes a CGOS based hardware monitor with logging functionality. Important note: Only compatible with cgos direct 3.1.0 and newer!
                  Wired_driver_30.4_x64.zip 23.10.2025 / 36.77 MB
                  Intel(R) Network Connections Software Version 30.4 for Intel i210/i219/i225/i226/E823-L for Windows 10 and Windows 11
                  Windows 10 IoT
                  CgosPy_1_3.zip 23.07.2024 / 655.40 KB
                  CgosPy is a Python package containing the cgos module which provides ctypes wrapper functions for accessing the CGOS API.
                  cgutlcmd_win_1.7.3.0.zip 08.12.2025 / 16.33 MB
                  congatec System Utility Rev. 1.7.3.0. for Windows. Use for BIOS update or customization and panel configuration. Important note: Only compatible with cgos direct version minimum 3.1.0!
                  Wired_driver_30.4_x64.zip 23.10.2025 / 36.77 MB
                  Intel(R) Network Connections Software Version 30.4 for Intel i210/i219/i225/i226/E823-L for Windows 10 and Windows 11
                  Windows 11
                  CgosPy_1_3.zip 23.07.2024 / 655.40 KB
                  CgosPy is a Python package containing the cgos module which provides ctypes wrapper functions for accessing the CGOS API.
                  CGOS_direct_Win10_Win11_3.2.0.zip 29.07.2026 / 16.54 MB
                  CGOS direct driver for Windows 10 and Windows 11.
                  cgutlcmd_win_1.7.3.0.zip 08.12.2025 / 16.33 MB
                  congatec System Utility Rev. 1.7.3.0. for Windows. Use for BIOS update or customization and panel configuration. Important note: Only compatible with cgos direct version minimum 3.1.0!
                  cgutlgui_qt_1.7.3.1.zip 20.05.2026 / 57.44 MB
                  Qt based GUI version of the congatec System Utility for Windows and Linux; Rev. 1.7.3.1. supports BIOS Capsule and Firmware update as well as BIOS customization and panel configuration. Provides easy access to all CGOS functions and includes a CGOS based hardware monitor with logging functionality. Important note: Only compatible with cgos direct 3.1.0 and newer!
                  Wired_driver_30.4_x64.zip 23.10.2025 / 36.77 MB
                  Intel(R) Network Connections Software Version 30.4 for Intel i210/i219/i225/i226/E823-L for Windows 10 and Windows 11
                  Windows 11 Iot
                  CgosPy_1_3.zip 23.07.2024 / 655.40 KB
                  CgosPy is a Python package containing the cgos module which provides ctypes wrapper functions for accessing the CGOS API.
                  CGOS_direct_Win10_Win11_3.2.0.zip 29.07.2026 / 16.54 MB
                  CGOS direct driver for Windows 10 and Windows 11.
                  cgutlcmd_win_1.7.3.0.zip 08.12.2025 / 16.33 MB
                  congatec System Utility Rev. 1.7.3.0. for Windows. Use for BIOS update or customization and panel configuration. Important note: Only compatible with cgos direct version minimum 3.1.0!
                  cgutlgui_qt_1.7.3.1.zip 20.05.2026 / 57.44 MB
                  Qt based GUI version of the congatec System Utility for Windows and Linux; Rev. 1.7.3.1. supports BIOS Capsule and Firmware update as well as BIOS customization and panel configuration. Provides easy access to all CGOS functions and includes a CGOS based hardware monitor with logging functionality. Important note: Only compatible with cgos direct 3.1.0 and newer!
                  Wired_driver_30.4_x64.zip 23.10.2025 / 36.77 MB
                  Intel(R) Network Connections Software Version 30.4 for Intel i210/i219/i225/i226/E823-L for Windows 10 and Windows 11

                  Product Variants

                  partnumber(s) found

                  conga-TCRP1/P185 (P/N 051800)

                  COM Express Compact module based on AMD Ryzen™ AI Embedded P185 processor with 12 Cores | Integrated XDNA 2™ NPU | Integrated RDNA™ 3.5 Graphics with 16 CUs | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial grade temperature range from 0°C to +60°C

                  conga-TCRP1/P174 (P/N 051801)

                  COM Express Compact module based on AMD Ryzen™ AI Embedded P174 processor with 10 Cores | Integrated XDNA 2™ NPU | Integrated RDNA™ 3.5 Graphics with 12 CUs | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial grade temperature range from 0°C to +60°C

                  conga-TCRP1/P164 (P/N 051802)

                  COM Express Compact module based on AMD Ryzen™ AI Embedded P164 processor with 8 Cores | Integrated XDNA 2™ NPU | Integrated RDNA™ 3.5 Graphics with 12 CUs | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial grade temperature range from 0°C to +60°C

                  conga-TCRP1/P132 (P/N 051803)

                  COM Express Compact module based on AMD Ryzen™ AI Embedded P132 processor with 6 Cores | Integrated XDNA 2™ NPU | Integrated RDNA™ 3.5 Graphics with 4 CUs | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial grade temperature range from 0°C to +60°C

                  conga-TCRP1/P121 (P/N 051804)

                  COM Express Compact module based on AMD Ryzen™ AI Embedded P121 processor with 4 Cores | Integrated XDNA 2™ NPU | Integrated RDNA™ 3.5 Graphics with 2 CUs | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial grade temperature range from 0°C to +60°C

                  conga-TCRP1/P185i (P/N 051810)

                  COM Express Compact module based on AMD Ryzen™ AI Embedded P185i processor with 12 Cores | Integrated XDNA 2™ NPU | Integrated RDNA™ 3.5 Graphics with 16 CUs | Dual channel SODIMM DDR5 5600 MT/s memory interface | Industrial grade temperature range from -40°C to +85°C

                  conga-TCRP1/P174i (P/N 051811)

                  COM Express Compact module based on AMD Ryzen™ AI Embedded P174i processor with 10 Cores | Integrated XDNA 2™ NPU | Integrated RDNA™ 3.5 Graphics with 12 CUs | Dual channel SODIMM DDR5 5600 MT/s memory interface | Industrial grade temperature range from -40°C to +85°C

                  conga-TCRP1/P164i (P/N 051812)

                  COM Express Compact module based on AMD Ryzen™ AI Embedded P164i processor with 8 Cores | Integrated XDNA 2™ NPU | Integrated RDNA™ 3.5 Graphics with 12 CUs | Dual channel SODIMM DDR5 5600 MT/s memory interface | Industrial grade temperature range from -40°C to +85°C

                  conga-TCRP1/P132i (P/N 051813)

                  COM Express Compact module based on AMD Ryzen™ AI Embedded P132i processor with 6 Cores | Integrated XDNA 2™ NPU | Integrated RDNA™ 3.5 Graphics with 4 CUs | Dual channel SODIMM DDR5 5600 MT/s memory interface | Industrial grade temperature range from -40°C to +85°C

                  conga-TCRP1/P121i (P/N 051814)

                  COM Express Compact module based on AMD Ryzen™ AI Embedded P121i processor with 4 Cores | Integrated XDNA 2™ NPU | Integrated RDNA™ 3.5 Graphics with 2 CUs | Dual channel SODIMM DDR5 5600 MT/s memory interface | Industrial grade temperature range from -40°C to +85°C

                  Ecosystem Details

                  Virtualization

                  conga-zones Hypervisor (P/N 300501)

                  Operating Systems

                  ctrlX OS (P/N 300020 )
                  Ubuntu Pro (P/N N/A)

                  IOT Software

                  Application Manager (P/N 300201)
                  COM Manager (P/N 300200)
                  Fleet Manager (P/N 300202)
                  Cloud Connector (P/N 300203)

                  Cooling Solutions

                  conga-TCRP1/CSA-HP-B (P/N 051850)

                  Standard active cooling solution for high performance COM Express module conga-TCRP1 with integrated heat pipes and 12V fan. All standoffs are with 2.7mm bore hole.
                  This cooling is compatible with conga-TCRP1 based on the following processors variants: P185, P174, P164, P185i, P174i, P164i.

                  conga-TCRP1/CSA-HP-T (P/N 051851)

                  Standard active cooling solution for high performance COM Express module conga-TCRP1 with integrated heat pipes and 12V fan. All standoffs are M2.5mm threaded.
                  This cooling is compatible with conga-TCRP1 based on the following processors variants: P185, P174, P164, P185i, P174i, P164i.

                  conga-TCRP1/CSP-HP-B (P/N 051852)

                  Standard passive cooling solution for high performance COM Express module conga-TCRP1 with integrated heat pipes. All standoffs are with 2.7mm bore hole.
                  This cooling is compatible with conga-TCRP1 based on the following processors variants: P185, P174, P164, P185i, P174i, P164i.

                  conga-TCRP1/CSP-HP-T (P/N 051853)

                  Standard passive cooling solution for high performance COM Express module conga-TCRP1 with integrated heat pipes. All standoffs are M2.5mm threaded.
                  This cooling is compatible with conga-TCRP1 based on the following processors variants: P185, P174, P164, P185i, P174i, P164i.

                  conga-TCRP1/HSP-HP-B (P/N 051854)

                  Standard heatspreader for high performance COM Express module conga-TCRP1 with integrated heat pipes. All standoffs are with 2.7mm bore hole.
                  This cooling is compatible with conga-TCRP1 based on the following processors variants: P185, P174, P164, P185i, P174i, P164i.

                  conga-TCRP1/HSP-HP-T (P/N 051855)

                  Standard heatspreader for high performance COM Express module conga-TCRP1 with integrated heat pipes. All standoffs are M2.5mm threaded.
                  This cooling is compatible with conga-TCRP1 based on the following processors variants: P185, P174, P164, P185i, P174i, P164i.

                  conga-TCRP1/K2e-CSA-HP-B (P/N 051860)

                  Standard active cooling solution for high performance COM Express module conga-TCRP1 with integrated heat pipes and 12V fan. All standoffs are with 2.7mm bore hole.
                  This cooling is compatible with conga-TCRP1 based on the following processors variants: P132, P121, P132i, P121i.

                  conga-TCRP1/K2e-CSA-HP-T (P/N 051861)

                  Standard active cooling solution for high performance COM Express module conga-TCRP1 with integrated heat pipes and 12V fan. All standoffs are M2.5mm threaded.
                  This cooling is compatible with conga-TCRP1 based on the following processors variants: P132, P121, P132i, P121i.

                  conga-TCRP1/K2e-CSP-HP-B (P/N 051862)

                  Standard passive cooling solution for high performance COM Express module conga-TCRP1 with integrated heat pipes. All standoffs are with 2.7mm bore hole.
                  This cooling is compatible with conga-TCRP1 based on the following processors variants: P132, P121, P132i, P121i.

                  conga-TCRP1/K2e-CSP-HP-T (P/N 051863)

                  Standard passive cooling solution for high performance COM Express module conga-TCRP1 with integrated heat pipes. All standoffs are M2.5mm threaded.
                  This cooling is compatible with conga-TCRP1 based on the following processors variants: P132, P121, P132i, P121i.

                  conga-TCRP1/K2e-HSP-HP-B (P/N 051864)

                  Standard heatspreader for high performance COM Express module conga-TCRP1 with integrated heat pipes. All standoffs are with 2.7mm bore hole.
                  This cooling is compatible with conga-TCRP1 based on the following processors variants: P132, P121, P132i, P121i.

                  conga-TCRP1/K2e-HSP-HP-T (P/N 051865)

                  Standard heatspreader for high performance COM Express module conga-TCRP1 with integrated heat pipes. All standoffs are M2.5mm threaded.
                  This cooling is compatible with conga-TCRP1 based on the following processors variants: P132, P121, P132i, P121i.

                  Memory

                  DDR5-SODIMM-5600 (8GB) (P/N 068930)

                  DDR5 SODIMM memory module with up to 5600 MT/s and 8GB RAM, commercial temp 0°C to +60°C

                  DDR5-SODIMM-5600 (16GB) (P/N 068931)

                  DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM, commercial temp 0°C to +60°C

                  DDR5-SODIMM-5600 (32GB) (P/N 068932)

                  DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM, commercial temp 0°C to +60°C

                  DDR5-SODIMM-5600 (48GB) (P/N 068933)

                  DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM, commercial temp 0°C to +60°C

                  DDR5-SODIMM-5600 ECC (16GB) (P/N 68941)

                  DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM with ECC, commercial temp 0°C to +60°C

                  DDR5-SODIMM-5600 ECC (32GB) (P/N 68942)

                  DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM with ECC, commercial temp 0°C to +60°C

                  DDR5-SODIMM-5600 ECC (48GB) (P/N 68943)

                  DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM with ECC, commercial temp 0°C to +60°C

                  DDR5-SODIMM-5600 (8GB) / i-temp (P/N 068935)

                  DDR5 SODIMM memory module with up to 5600 MT/s and 8GB RAM, industrial temp -40°C to +85°C

                  DDR5-SODIMM-5600 (16GB) / i-temp (P/N 068936)

                  DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM, industrial temp -40°C to +85°C

                  DDR5-SODIMM-5600 (32GB) / i-temp (P/N 068937)

                  DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM, industrial temp -40°C to +85°C

                  DDR5-SODIMM-5600 (48GB) / i-temp (P/N 068938)

                  DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM, industrial temp -40°C to +85°C

                  DDR5-SODIMM-5600 ECC (16GB) / i-temp (P/N 068946)

                  DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM with ECC, industrial temp -40°C to +85°C

                  DDR5-SODIMM-5600 ECC (32GB) / i-temp (P/N 068947)

                  DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM with ECC, industrial temp -40°C to +85°C

                  DDR5-SODIMM-5600 ECC (48GB) / i-temp (P/N 068948)

                  DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM with ECC, industrial temp -40°C to +85°C

                  Carrierboards

                  conga-TEVAL/COMe 3.0 (P/N 065821)

                  congatec COM Express Type 6 evaluation carrier compliant to COM Express 3.0 specification. Industrial temperature range -40°C to 85°C.

                  Module services

                  Design-In Training (P/N 27000001)

                  Design-Training to develop carrier boards for Computer on Modules

                  What is aReady.COM?

                  aReady.COM is congatec’s pre-validated and pre-configured platform that combines modular hardware and software building blocks to accelerate embedded development. It includes Computer-on-Modules, virtualization by Hypervisor, and pre-installed, licensed OS like ctrlX OS or Ubuntu Pro. Whether for edge computing or IIoT, aReady.COM simplifies integration, enhances security, and shortens time to market.


                  Learn more