Boost your applications with
Leading-edge performance
COM-HPC and COM Express modules with
Raptor Lake and/or Bartlett Lake processors
Take your applications to the next level with Intel® Core™ S processors & 13th Gen Intel® Core™ processors
Computer-on-Modules for performance hungry edge computer designs
Get the benefits of a hybrid architecture with the Intel® Core™ S processors and 13th Gen Intel® Core™ processors. Code named Bartlett Lake and Raptor Lake, these chips combine powerful P-cores and efficient E-cores to deliver the best of both worlds—all in platform with long-life availability for embedded and edge computing.
The Intel Core S processors and 13th Gen processors offer major improvements in many areas — including AI performance and I/O capabilities — yet are hardware compatible with their predecessors. This makes it easy for OEMs to adopt the new technologies, significantly optimizing time-to-market for new designs and providing an instant upgrade for existing solutions based on previous Intel® Core™ processor generations.
With these high-performance oriented Computer-on-Modules, OEMs can gain quick access to this future-oriented technology on three different module families in the COM-HPC Mini, Client Size A and Size C as well as COM Express standards. Each brings unique advantages to a wide range of different applications with individual demands. Target applications include AI-based vision systems, autonomous mobile robots, digital signage for AI-driven in-store advertising, as well as medical imaging and video-centric applications like Network Video Recorder (NVR) with AI box.
Intel® Core™ S & 13th Gen Intel® Core™ processor technology at a glance
Overview
- Performance hybrid architecture with powerful P-cores and efficient E-cores
- Soldered and socketed CPU versions
- Pin- and software compatible to predecessor
Enhanced Features
- Intel Thread Director 2 for ideal performance/power balancing
- PCIe Gen 4 and Gen 5 on selected SKUs for increased bandwidth
- DDR5 memory support for accelerated data handling
AI and GPU
- Intel Xe graphics architecture
- Intel Deep Learning Boost (VNNI) support
- Supports the Intel® Distribution of OpenVINO™
- Supports up to 48 simultaneous 1080p video streams ingestion
congatec’s product portfolio
conga-HPC/cRLS
- 13th Generation Intel® Core™
- Intel® performance hybrid architecture
- Performance-optimized design
- Up to 24 cores
- PCIe Gen 5
conga-HPC/cRLP
- 13th Generation Intel® Core™
- Intel® performance hybrid architecture
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 5
conga-HPC/cBLS
- 13th/14th Gen Intel® Core™ processors
- Hybrid design with P-cores & E-cores
- Intel® UHD Graphics 770
- PCIe Gen 4/5 & USB 3.2 Gen 2
conga-HPC/mRLP
- 13th Generation Intel® Core™
- Intel® Xe graphics engine
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 4
conga-TC675r
- 13th Generation Intel® Core™
- Soldered memory
- Extended temperature range options
- Up to 14 cores
- PCIe Gen 4
conga-TC675
- 13th Generation Intel® Core™
- Intel® Performance Hybrid Architecture
- Extended temperature range options
- Up to 14 cores
- PCIe Gen 4
Benefits of our 13th Gen Intel® Core™ processor based module families include:
- Superior competitive solutions thanks to high-performance upgrades
- Simplified design-in thanks to backwards compatibility to predecessors with 12th Gen Intel® Core™ processors
- Powerful edge AI capabilities plus comprehensive API support including Intel® Deep Learning Boost (VNNI) and support for the Intel® Distribution of OpenVINO™ toolkit
- Extremely capable multi-thread and multi-machine designs thanks to high core count of up to 8 P-cores and 16 E-cores
- Immersive graphics solutions thanks to high-performance Intel® UHD or Xe graphics engine
- Optimized workflow for medical diagnostic workstations for radiology and endoscopy thanks to support of up to 4x 4k displays with 60 Hz or 1x 8k
- Optimized for video applications thanks to support of up to 48 simultaneous 1080p video streams ingestion
Board support packages
As all congatec modules and boards come with tailored board support packages featuring all required drivers and firmware tools, designers have everything they need to install the applications and run programming, debugging and test routines to realize their next-gen designs with COM-HPC Client and COM Express Compact modules based on Intel® Core™ S and 13th Gen Intel® Core processors.
System consolidation for increased solution efficiency
For consolidated system designs, all modules based on the Intel® Core™ S and 13th Gen Intel® Core™ processor come with native support for aReady.VT. This enables designers to consolidate multiple workloads that previously required several dedicated systems on one single system. This not only delivers cost advantages but also helps to improve overall application reliability. Please visit https://www.congatec.com/en/aready/areadyvt to learn more.
Want to know more?
Everything you need to know about COMs
Computer-on-Modules (COMs) power everything from robotics and medical devices to edge computing and smart mobility. But what makes them so versatile? And which standard is right for your needs? Explore the answers in our comprehensive guide to COMs.
