Take your applications to the next level with 13th Gen Intel® Core™ processor technology

Welcome to twelve brand-new Computer-on-Modules for high end embedded computer designs

13th Gen Intel® Core™ processors take the innovative performance hybrid architecture with powerful P-cores and efficient E-cores to the next level. Compared to their predecessors, the 13th Gen processors with long life availability offer vast improvements in many features yet are hardware and BIOS software compatible. This makes implementation very fast and easy so OEMs can significantly optimize the time to market for their new designs or instantly upgrade already existing high-end embedded and edge computing solutions based on the previous Intel® Core™ processor technology.

With our latest Computer-on-Modules, OEMs can gain quick and easy access to this future oriented technology on three different module families in the COM-HPC Client Size A and Size C as well as COM Express standards. Each brings unique advantages to an extremely wide range of different applications with individual demands. Target applications include AI-based vision systems, autonomous mobile robots, digital signage for AI-driven in-store advertising, as well as medical imaging and video centric applications like Network Video Recorder (NVR) with AI box. 

13th Gen Intel® Core™ processor technology at a glance


  • Performance hybrid architecture with powerful P-cores and efficient E-cores
  • Soldered and socketed CPU versions
  • Pin- and software compatible to predecessor

Enhanced Features

  • Intel Thread Director 2 for ideal performance/power balancing
  • PCIe Gen 4 and Gen 5 on selected SKUs for increased bandwidth
  • DDR5 memory support for accelerated data handling

AI and GPU

  • Intel Xe graphics architecture
  • Intel Deep Learning Boost (VNNI) support
  • Supports the Intel® Distribution of OpenVINO™
  • Supports up to 48 simultaneous 1080p video streams ingestion

congatec’s product portfolio


The COM-HPC Client Size C module conga-HPC/cRLS, which measures 120x160mm and provides up to 24 cores and 32 threads, addresses application areas that require particularly high multi-core and multi-thread performance, large caches, and enormous memory capacities combined with high bandwidth and advanced I/O technology.

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The COM-HPC Client Size A module conga-HPC/cRLP supports the full range of innovative interfaces provided by the 13th Gen Intel® Core™ processors, including PCIe Gen 4 and even Gen 5 on selected SKUs, 2x Thunderbolt, and 2x USB 3.2 Gen 2x1. Available in six different processor variants with a CPU base power of 15 W to 45 W, these modules are an ideal fit for the design of future oriented high-performance applications

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The COM Express Compact Type 6 module conga-TC675 follows the COM Express 3.1 specification. Thus, it boasts the latest standard compliant interface technology with significantly increased bandwidth, including up to 8x PCI Express Gen 4, up to 4x USB 3.2, and 2x 2.5 GbE with TSN support. With its highly scalable 15 W to 45 W CPU base power, it is perfect for simple upgrades of existing COM Express designs. 

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Benefits of our 13th Gen Intel® Core™ processor based module families include:

  • Superior competitive solutions thanks to latest performance upgrades
  • Simplified design-in thanks to backwards compatibility to predecessors with 12 Gen Intel® Core™ processors
  • Powerful edge AI capabilities plus comprehensive API support including Intel® Deep Learning Boost (VNNI) and support for the Intel® Distribution of OpenVINO™ toolkit
  • Extremely capable multi-thread and multi-machine designs thanks to high core count of up to 8 P-cores and 16 E-cores
  • Immersive graphics solutions thanks to high-performance Intel® Xe graphics engine
  • Optimized workflow for medical diagnostic workstations for radiology and endoscopy thanks to support of 4x 4k displays with 60 Hz or 1x 8k
  • Optimized for video applications thanks to support of up to 48 simultaneous 1080p video streams ingestion

Board support packages

As all congatec modules and boards come with tailored board support packages featuring all required drivers and firmware tools, designers have everything they need to install the applications and run programming, debugging and test routines to realize their next-gen designs with 13th Gen Intel® Core™ based COM-HPC Client and COM Express Compact modules.

System consolidation for increased solution efficiency

For consolidated system designs, all 13th Gen Intel® Core™ processor based modules come with native support for the real-time hypervisor from Real-Time Systems. This enables designers to consolidate multiple workloads that previously required several dedicated systems on one single system. This not only delivers cost advantages but also helps to improve overall application reliability. Please visit https://www.real-time-systems.com to learn more.

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