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conga-sdIL

COM-HPC Server Size D module based on Intel® Xeon® D-1700 / D-1800 (code name "Ice Lake")

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        conga-sdIL

        formerly JUMPtec COMh-sdIL
        COM-HPC Server Size D module based on Intel® Xeon® D-1700 / D-1800 (code name "Ice Lake")

        Learn all about COMs - download the guide

        • Industrial Use Condition with extended Temperature options
        • Intel® Xeon® D-1700 / D-1800 SOC processors
        • 8x LAN Ports: versatile configurations up to 100G
        • Up to 1 TByte NVMe SSD onboard
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        Do you want to add further ecosystem parts (carrier boards, memory,...) to your request?

        Value adding ecosystem offerings

        Carrierboards

        Cooling Solutions

        Specification

        Formfactor
        COM-HPC
        CPU
        Intel® Xeon® D-1715TER (4 x 2.4 GHz, 10 MB cache, 50G Eth, 50W)
        Intel® Xeon® D-1732TE (8 x 1.9 GHz, 15 MB cache, 50G Eth, 52W)
        Intel® Xeon® D-1746TER (10 x 2.0 GHz, 15 MB cache, 100G Eth, 67W)
        DRAM
        Up to 64GB DDR4-2667 soldered memory - ECC, extended temp
        Ethernet
        1 x 1/2.5 Gb Ethernet
        100GbE/2x 50GbE/4x 25GbE/2x 25GbE + 4x 10GbE/8x 10GbE
        I/O Interfaces
        16 x PCIe Gen4
        16 x PCIe Gen3
        4 x USB 3.0
        4 x USB 2.0
        2 x SATA 6 Gb/s
        SPI
        eSPI
        SM-Bus
        SATA Gen 3.2
        Mass storage
        Up to 1 TByte NVMe SSD (on request)
        embedded BIOS Features
        AMI Aptio UEFI
        Security
        Trusted Platform Module (TPM 2.0)
        Power Management
        ACPI 6.0
        Operating Systems
        Linux
        Microsoft® Windows 11
        Microsoft® Windows® 10
        Windows Server 2022
        Temperature
        Commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating
        Industrial temperature: -40 °C to +85 °C operating, -40 °C to +85 °C non-operating
        Humidity
        93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78)
        Features
        Staged Watchdog
        Size
        120 x 160 mm

        Documents

        All documents found on this page are updated without notification. Always check this page for the latest version.

        Data Sheet

        Data sheet for conga-sdIL
        15.12.2025

        Whitepaper

        The Computer-on-Modules Compendium Download for free and gain the ultimate reference guide to COM technology. From fundamentals to advanced use cases – this compendium helps you design faster, smarter, and more efficiently.

        Product Variants

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            There are 1,000's of possible configurations of our products, and therefore every possible configuration may not be shown with this tool.
            If you don't find the configuration you require contact your congatec Sales representative for further assistance.
            conga-sdIL/D-1746TER (P/N HSD04-6400-46-1)

            COM-HPC® Server Size D module with Intel® Xeon® D-1746TER processor, 64 GB ECC memory, SoC-LAN support for 4× 25G-KR and operating temperature from −40 °C to +85 °C.

            conga-sdIL/D-1732TE (P/N HSD04-3200-32-1)

            COM-HPC® Server Size D module with Intel® Xeon® D-1732TE processor, 32 GB ECC memory, SoC-LAN support for 5× 10G-KR and operating temperature from −40 °C to +85 °C.

            conga-sdIL/D-1715TER (P/N HSD04-1600-15-1)

            COM-HPC® Server Size D module with Intel® Xeon® D-1715TER processor, 16 GB ECC memory, SoC-LAN support for 5× 10G-KR and operating temperature from −40 °C to +85 °C.

            Ecosystem Details

            Carrierboards

            COM-HPC/SERVER EVAL-CARRIER (P/N HST01-0001-10-0)

            Evaluation Carrier with 10-mm stack-up connector

            Cooling Solutions

            COMh-sdIL (E2) HSP THREADED (P/N HSD04-0000-99-0)

            COMh-sdIL (E2) heatspreader threaded

            COMh-sdIL (E2) HSP THROUGH HOLE (P/N HSD04-0000-99-1)

            COMh-sdIL (E2) heatspreader through hole

            COMh SIZE D ACTIVE UNI COOLER (W/O HSP) (P/N HSD99-0000-99-0)

            COM-HPC Size D Universal Active Cooler for Heatspreader Mounting (160 x 100 x 46 mm)

            COMh SIZE D PASSIVE UNI COOLER (W/O HSP) (P/N HSD99-0000-99-1)

            COM-HPC Size D Universal Passive Cooler for Heatspreader Mounting (160 x 100 x 46 mm)

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