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conga-TCRP1

COM Express® Compact Module based on AMD RYZEN™ AI Embedded P100 Series

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          conga-TCRP1

          COM Express® Compact | Type 6 connector pinout based on AMD Ryzen™ AI Embedded P100 Series

          Learn all about COMs - download the guide

          • AMD Zen5/5c CPU Cores
          • AMD Radeon™ RDNA™ 3.5 Graphics
          • AMD XDNA™ 2 NPU
          • TDP Range from 15W to 54W
          • Onboard NVMe™ SSD (option)
          Congatec Logo
          Do you want to add further ecosystem parts (carrier boards, memory,...) to your request?

          Value adding ecosystem offerings

          Cooling Solutions

          Memory

          Carrierboards

          Specification

          Formfactor
          COM Express Compact
          CPU
          AMD Ryzen™ AI Embedded P132 (6 x 4.5 GHz, 8 MB cache, 28 W)
          AMD Ryzen™ AI Embedded P121 (4 x 4.4 GHz, 8 MB cache, 28 W)
          AMD Ryzen™ AI Embedded P132i (6 x 4.5 GHz, 8 MB cache, 28 W)
          AMD Ryzen™ AI Embedded P121i (4 x 4.5 GHz, 8 MB cache, 28 W)
          DRAM
          2 SODIMM sockets for DDR5 memory modules up to 48 GB each (max. 96 GB RAM system capacity) | up to 5600 MT/s | ECC supported
          Ethernet
          2.5 GbE via Intel® i226 Ethernet controller series
          I/O Interfaces
          4 x USB 3.2 Gen2
          4 x USB 2.0
          2 x SATA 6Gb/s (if NVMe™ SSD option is not used)
          8 x PCIe Gen4
          PEG x4 Gen4
          1 x I²C bus
          1 x GPSPI
          2 x UART
          8 x GPIO
          1 x SM-Bus
          1 x LPC
          Mass storage
          NVMe™ SSD up to 512 GB capacity (option instead of SATA ports)
          Graphics
          Integrated AMD Radeon™ RDNA™ 3.5 Graphics with up to 4x CUs (Compute Units)
          NPU/AI Acceleration
          Integrated XDNA 2™ NPU with up to 50 TOPs
          congatec Board Controller
          Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection
          embedded BIOS Features
          AMI Aptio® UEFI firmware
          32 Mbyte serial SPI with congatec Embedded BIOS feature
          OEM Logo
          OEM CMOS Defaults
          LCD Control
          Display Auto Detection
          Backlight Control
          Flash Update
          Security
          Trusted Platform Module (TPM 2.0)
          Power Management
          ACPI 6.0 with battery support
          Operating Systems
          Microsoft® Windows 11
          Microsoft® Windows 11 IoT Enterprise
          Linux
          Hypervisor
          RTS Real-Time Hypervisor
          Temperature
          Commercial variants: Operation: 0° to +60°C | Storage: -20° to +80°C
          Industrial variants: Operation: -40° to +85°C | Storage: -40° to +85°C
          Humidity
          Operating: 10 to 85% r. H. non cond. / Storage 5 to 85% r. H. non cond.
          Video Interfaces
          Up to 3x DDI
          LVDS or eDP
          4 x independent displays
          Size
          95 x 95 mm (3,74" x 3,74")

          Documents

          All documents found on this page are updated without notification. Always check this page for the latest version.

          Data Sheet

          conga-TCRP1.pdf
          12.01.2026

          Whitepaper

          The Computer-on-Modules Compendium Download for free and gain the ultimate reference guide to COM technology. From fundamentals to advanced use cases – this compendium helps you design faster, smarter, and more efficiently.

          Product Variants

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              There are 1,000's of possible configurations of our products, and therefore every possible configuration may not be shown with this tool.
              If you don't find the configuration you require contact your congatec Sales representative for further assistance.
              conga-TCRP1/P132 (P/N 051803)

              COM Express Compact module based on AMD Ryzen™ AI Embedded P132 processor with 6 Cores | Integrated XDNA 2™ NPU | Integrated RDNA™ 3.5 Graphics with 4 CUs | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial grade temperature range from 0°C to +60°C

              conga-TCRP1/P121 (P/N 051804)

              COM Express Compact module based on AMD Ryzen™ AI Embedded P121 processor with 4 Cores | Integrated XDNA 2™ NPU | Integrated RDNA™ 3.5 Graphics with 2 CUs | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial grade temperature range from 0°C to +60°C

              conga-TCRP1/P132i (P/N 051813)

              COM Express Compact module based on AMD Ryzen™ AI Embedded P132i processor with 6 Cores | Integrated XDNA 2™ NPU | Integrated RDNA™ 3.5 Graphics with 4 CUs | Dual channel SODIMM DDR5 5600 MT/s memory interface | Industrial grade temperature range from -40°C to +85°C

              conga-TCRP1/P121i (P/N 051803)

              COM Express Compact module based on AMD Ryzen™ AI Embedded P121i processor with 4 Cores | Integrated XDNA 2™ NPU | Integrated RDNA™ 3.5 Graphics with 2 CUs | Dual channel SODIMM DDR5 5600 MT/s memory interface | Industrial grade temperature range from -40°C to +85°C

              Ecosystem Details

              Cooling Solutions

              conga-TCRP1/CSA-HP-B (P/N 051850)

              Standard active cooling solution for high performance COM Express module conga TCRP1 with integrated heat pipes and 12V fan. All standoffs are with 2.7mm bore hole.

              conga-TCRP1/CSA-HP-T (P/N 051851)

              Standard active cooling solution for high performance COM Express module conga TCRP1 with integrated heat pipes and 12V fan. All standoffs are M2.5mm threaded.

              conga-TCRP1/CSP-HP-B (P/N 051852)

              Standard passive cooling solution for high performance COM Express module conga TCRP1 with integrated heat pipes. All standoffs are with 2.7mm bore hole.

              conga-TCRP1/CSP-HP-T (P/N 051853)

              Standard passive cooling solution for high performance COM Express module conga TCRP1 with integrated heat pipes. All standoffs are M2.5mm threaded.

              conga-TCRP1/HSP-HP-B (P/N 051854)

              Standard heatspreader for high performance COM Express module conga-TCRP1 with integrated heat pipes. All standoffs are with 2.7mm bore hole.

              conga-TCRP1/HSP-HP-T (P/N 051855)

              Standard heatspreader for high performance COM Express module conga-TCRP1 with integrated heat pipes. All standoffs are M2.5mm threaded.

              Memory

              DDR5-SODIMM-5600 (8GB) (P/N 068930)

              DDR5 SODIMM memory module with up to 5600 MT/s and 8GB RAM, commercial temp 0°C to +60°C

              DDR5-SODIMM-5600 (16GB) (P/N 068931)

              DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM, commercial temp 0°C to +60°C

              DDR5-SODIMM-5600 (32GB) (P/N 068932)

              DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM, commercial temp 0°C to +60°C

              DDR5-SODIMM-5600 (48GB) (P/N 068933)

              DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM, commercial temp 0°C to +60°C

              DDR5-SODIMM-5600 ECC (16GB) (P/N 68941)

              DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM with ECC, commercial temp 0°C to +60°C

              DDR5-SODIMM-5600 ECC (32GB) (P/N 68942)

              DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM with ECC, commercial temp 0°C to +60°C

              DDR5-SODIMM-5600 ECC (48GB) (P/N 68943)

              DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM with ECC, commercial temp 0°C to +60°C

              DDR5-SODIMM-5600 (8GB) / i-temp (P/N 068935)

              DDR5 SODIMM memory module with up to 5600 MT/s and 8GB RAM, industrial temp -40°C to +85°C

              DDR5-SODIMM-5600 (16GB) / i-temp (P/N 068936)

              DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM, industrial temp -40°C to +85°C

              DDR5-SODIMM-5600 (32GB) / i-temp (P/N 068937)

              DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM, industrial temp -40°C to +85°C

              DDR5-SODIMM-5600 (48GB) / i-temp (P/N 068938)

              DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM, industrial temp -40°C to +85°C

              DDR5-SODIMM-5600 ECC (16GB) / i-temp (P/N 068946)

              DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM with ECC, industrial temp -40°C to +85°C

              DDR5-SODIMM-5600 ECC (32GB) / i-temp (P/N 068947)

              DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM with ECC, industrial temp -40°C to +85°C

              DDR5-SODIMM-5600 ECC (48GB) / i-temp (P/N 068948)

              DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM with ECC, industrial temp -40°C to +85°C

              Carrierboards

              conga-TEVAL/COMe 3.0 (P/N 065821)

              congatec COM Express Type 6 evaluation carrier compliant to COM Express 3.0 specification. Industrial temperature range -40°C to 85°C.

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