COM Express Type 6 Compact module with Intel® Core™ i7-7600U dual core processor with 2.8GHz up to 3.9GHz, 4MB Intel® Smart Cache , GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U).
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conga-TC175 (EOL)
COM Express Type 6 Compact module based on 7th Generation Intel® Core™ processor family
Learn all about COMs - download the guide
- 7th Generation Intel® Core™ SOC processor
- Intel® Gen9 HD Graphics with HEVC (H.265) support
- Intel® Optane™ memory can be connected via PCI Express Gen 3.0
- Low power consumption (TDP 15W, cTDP 7.5W)
- Up to 32 GByte dual channel DDR4 memory
Specification
OpenCL 2.0/2.1, OpenGL 4.4/4.5 and DirectX12 (for Windows 10) support | up to three independent displays: DDI / DisplayPort 1.2 / eDP 1.3 | High performance hardware MPEG-2 decoding | WMV9 (VC-1) and H.265 (HEVC) support Blu-ray support @ 40 MBit/s | HEVC, VP9 and VDENC encoding
The conga-TC175 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM 1.2 / 2.0). It is capable of calculating efficient hash and RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e commerce will benefit also with improved authentication, integrity and confidence levels.
Operating: 0 to +60°C Storage: -20 to +80°C
Documents
Data Sheet
Whitepaper
Software
Use for BIOS update or customization and panel configuration. Linux source version.
Important note: Only compatible with cgos 1.03.032 and older!
Important note: Only compatible with cgos 1.03.032 and older!
Important note: Only compatible with cgos direct 3.1.0 and newer!
Important note: Only compatible with cgos 1.03.032 and older!
Important note: Only compatible with cgos direct 3.1.0 and newer!
Product Variants
COM Express Type 6 Compact module with Intel® Core™ i5-7300U dual core processor with 2.6GHz up to 3.5GHz, 3MB Intel® Smart Cache , GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U)
COM Express Type 6 Compact module with Intel® Core™ i3-7100U dual core processor with 2.4GHz, 3MB Intel® Smart Cache , GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U)
COM Express Type 6 Compact module with Intel® Celeron® 3965U dual core processor with 2.2GHz, 2MB Intel® Smart Cache, GT1 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U)
Ecosystem Details
Cooling Solutions
Standard heatspreader for COM Express modules conga-TC97, TC170 and TC175. All standoffs are with 2.7mm bore hole.
Standard heatspreader for COM Express modules conga-TC97, TC170 and TC175. All standoffs are M 2.5 threaded
Standard passive cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are with 2.7mm bore hole.
Standard passive cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are M 2.5 threaded
Standard active cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are with 2.7mm bore hole, 15mm fins, 18mm overall heat sink height and integrated 12V fan.
Standard active cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are M 2.5 threaded, 15mm fins, 18mm overall heat sink height and integrated 12V fan.
Memory
DDR4 SODIMM memory module with 2400 MT/s and 4GB RAM
DDR4 SODIMM memory module with 2400 MT/s and 8GB RAM
DDR4 SODIMM memory module with 2400 MT/s and 16GB RAM
Carrierboards
Evaluation carrier board for COM Express Type6 Rev. 3.0 modules.
Module services
Design-Training to develop carrier boards for Computer on Modules
HumiSeal® 1A33 coating for COM Express Basic and Compact modules; MIL-I-46058C qualified, IPC-CC-830 and
RoHS Directive 2002/95/EC compliant and recognized under UL File Number E105698.
congatec Wide Temperature Range Screening
Standard screening profile with 12h temperature screening and cold soak test
Including functional test and several boot-ups (before & after screening)
congatec Wide Temperature Range Screening
Standard screening profile with 12h temperature screening and cold soak test
Including functional test and several boot-ups (before & after screening)
Accessories
conga-LDVI
DVI Converter Module for LVDS
conga-TEVAL/COMe 2.1 (EOL)
Evaluation Carrier Board for COM Express® Type 6 Modules Rev. 2.1
conga-TEVAL/COMe 2.1 (EOL)
Scheda Carrier di valutazione per i Moduli COM Express® Type 6
conga-LDVI
Covertitore di moduli DVI perLVDS













