Designed for high-performance embedded and edge computing applications, our performance-class modules integrate latest multicore CPUs as well as GPUs for immersive graphics and/or accelerating AI inference workloads. They offer extremely high scalability for applications ranging from powerful PLCs, HMIs and shop-floor systems to immersive digital signage systems and high-performance medical equipment.

COM-HPC Client

Is ideal for next-generation high-end embedded and edge computing applications

More about conga-HPC/cPTL

conga-HPC/cPTL

  • Intel® performance hybrid design with up to 16 cores
  • LPCAMM2 socket for LPDDR5 memory
  • Integrated NPU for dedicated AI acceleration
  • Up to PCI Express Gen5
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More about conga-HPC/cBLS

conga-HPC/cBLS

  • 13th/14th Gen Intel® Core™ processors
  • Hybrid design with P-cores & E-cores
  • Intel® UHD Graphics 770
  • PCIe Gen 4/5 & USB 3.2 Gen 2
  • AI acceleration with Intel® VNNI
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More about conga-HPC/cRLS

conga-HPC/cRLS

  • 13th/14th Generation Intel® Core™
  • Intel® performance hybrid architecture
  • Performance-optimized design
  • Up to 24 cores
  • PCIe Gen 5
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More about conga-HPC/cRLP

conga-HPC/cRLP

  • 13th Generation Intel® Core™
  • Intel® performance hybrid architecture
  • Rugged soldered processor
  • Industrial temperature support
  • PCIe Gen 5
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COM-HPC Mini

Offers extraordinary performance and I/O density for space- and power-restricted applications

More about conga-HPC/mPTL

conga-HPC/mPTL

  • Intel® performance hybrid design with up to 16 cores
  • Integrated NPU for dedicated AI acceleration
  • Onboard LPDDR5x with in-band ECC on selected
  • product variants Onboard NVMe SSD with 128GB
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More about conga-HPC/mIQ-X

conga-HPC/mIQ-X

  • Qualcomm® Dragonwing IQ-X processors
  • Up to 12 Oryon™ CPU cores
  • Hexagon™ NPU with 45 TOPS
  • Up to 64 GB LPDDR5x
  • Industrial Temp. Range
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More about conga-HPC/mRLP

conga-HPC/mRLP

  • 13th Generation Intel® Core™
  • Intel® Xe graphics engine
  • Rugged soldered processor
  • Industrial temperature support
  • PCIe Gen 4
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COM Express Type 6

Is the most elaborated high-performance ecosystem for the entire range of embedded computing applications

More about conga-TC1000r

conga-TC1000r

  • Intel® performance hybrid architecture with up to 16 cores
  • Intel® Arc™ Graphics or Intel Graphics
  • Integrated NPU with up to 50 TOPS and up to 180 TOPS total platform performance
  • LPCAMM2 LPDDR5 memory with up to 96 GB RAM system capacity 
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More about conga-TC1000

conga-TC1000

  • Up to 16 cores and 22 threads
  • Intel® Arc™ Graphics Xᵉ3 up to 192 EU
  • Integrated NPU with 50 TOPS, 180 TOPS total platform performance
  • Up to 128 GB RAM with in-band ECC
  • Industrial Temperature Range -40°C to +85°C
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More about conga-TCR8

conga-TCR8

  • Up to 8 Zen 4 cores
  • AMD Radeon™ RDNA™ 3 Graphics
  • AMD XDNA™ NPU
  • Up to 96 GB RAM (optional with ECC)
  • TDP Range from 15W to 54W
  • Onboard NVMe™ SSD (option)
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More about conga-TC750

conga-TC750

  • Intel® Arc™ Graphics with up to 128 EUs
  • Up to 99 TOPS Edge AI performance
  • Up to 128 GB RAM with in-band ECC
  • Up to 16 cores / 22 threads
  • PCIe Gen 4 & USB 4
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More about conga-bRP6

conga-bRP6

  • 13th Generation Intel® Core™ Processors
  • Up to 64 GByte DDR5 memory
  • Up to 2.5 Gb Ethernet with TSN support
  • Optional NVMe SSD onboard
  • Industrial grade versions
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