Let’s meet at embedded world 2023 in hall 3, Booth 241!

March 14th-16th

At our booth you will experience an exciting range of brand-new products and ecosystem offerings as well as inspiring solution examples for some of the most important vertical markets.

High Performance Landscape

Challenge the megatrends together with us and create new opportunities with our High Performance Landscape

We offer you much more than innovative and future-oriented modules.
Visit us at our stand and experience the systemic and holistic approach we use to break new ground together with you.

Here is what you can be looking forward to:

COM-HPC – the paradigm change for modular designs

Experience the industry’s most comprehensive COM-HPC Client and Server module ecosystem now with three new COM-HPC product families based on 13th Gen Intel® Core™ processor technology.

Find our COM-HPC portfolio here



More bandwidth and performance for COM Express

Our new COM Express 3.1 compliant modules help you to secure investments in existing designs for many more years, which includes upgrade options for more data throughput thanks to PCIe Gen 4 support.

Find our COM Express portfolio here

Set yourself into scene at our booth and win an iPad Pro

Stop by, set yourself into scene, share the image on LinkedIn and win an iPad Pro. 
Each day, we will give away an iPad Pro. The winners will be announced on Tuesday and Wednesday at 17:45 and on Thursday at 16:30 at the congatec booth 241 in hall 3.

Make sure to join us for a drink and the excitement of finding out if you are the lucky winner!

These are only a few selected highlights at our embedded world booth.
But we have a lot more for you to explore. 

Arrange a meeting with us today and let us discuss how to accelerate your applications

Arrange meeting

Get your free ticket
Redeem your free entry ticket with our voucher code ew23492685

Free Ticket

Further events you don’t want to miss at embedded world

Networking hourTuesday & Wednesday
starting at 5:00 pm
congatec booth
Press conferenceTuesday, 14 March 2023,
2:00 to 2:30 pm
Room Hongkong, 
NCC East, Level 1

Presentation “COM-HPC Server-on-Modules”

Thursday, 16 March 2023,
2:15 to 2:45 pm
Session 5.7 / HW Solutions
embedded world Conference 2023


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