Announcing congatec’s first Qseven module with single-chip, quad-core Intel® Atom™ processor E3800 family
The conga-QA3 provides twice the performance over its predecessor plus an optimized product lifespan thanks to development with ceramic condensators
Deggendorf, Germany, 8 October 2013 * * * congatec AG, a leading manufacturer of embedded computer modules, announces the immediate availability of the conga-QA3 Qseven module based on the Intel® Atom™ processor E3845. All modules are fitted with ceramic capacitors making them ideal for industrial mobile applications in harsh environments. New features include an ample L2 cache, which can be shared by multiple cores, and a much faster Intel HD graphics unit compared with the previous generation. This turns new applications into visual experiences.
The modules support Intel® Advanced Encryption Standard New Instructions (Intel® AES-NI) set, which is more relevant than ever in practical application. This allows developers to offload particularly compute-intensive packaging and encryption routines of the well-known cryptographic algorithm AES (Advanced Encryption Standard) into hardware, thereby enabling high performance encryption without putting a significant burden on the CPU cores.
The conga-QA3 comes in five different Intel Atom processor-based versions (formerly codenamed “Bay Trail”) for high scalability. It ranges from the entry-level single-core Intel® Atom™ processor E3815 with 1.46 GHz and a low power consumption of 5 watts, up to the quad-core Intel® Atom™ processor E3845 with 1.91 GHz and 10 watts.
The Qseven modules are each equipped with 2 GB of DDR3L memory and up to 16 GB eMMC 4.5 for mass storage. Depending on which processor is used, versions with 8 GB of RAM are available. The integrated graphics are significantly more powerful than the previous model and support DirectX 11, OpenGL 3, OpenCL 1.2 and high-performance, flexible hardware decoding to decode even multiple high-resolution full HD videos in parallel.
Up to 2,560 x 1,600 pixels with DisplayPort and 1,920 x 1,200 pixels with HDMI are natively supported in the processor. It is also possible to connect up to two independent display interfaces via 2x 24-bit LVDS.
Thanks to native USB 3.0 support, the modules achieve fast data transmission with low power consumption. One of the five provided USB 2.0 ports is executed as USB 3.0 SuperSpeed.
Three PCI Express 2.0 lanes and two SATA interfaces with up to 3 Gb/s enable fast and flexible system extensions. The Intel® Ethernet Controller I210 guarantees the best software compatibility. Completing the feature set are: MIPI camera interface, I2C bus, LPC bus for easy integration of legacy I/O interfaces and Intel® High Definition Audio.