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conga-QMX8 (discontinued)

Highest performance Qseven module based on NXP i.MX8 processor series

  • Product status: Discontinued
  • NXP i.MX 8 processor series with ARM Cortex-A72 / A53 / M4F core complex
  • Advanced Performance and Virtualization
  • Graphics up to 4k display resolution
  • Vision extensions and dual MIPI camera support
  • Extended longevity up to 15 years
  • Temperature range up to -40°C …+85°C
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Do you want to add further ecosystem parts (carrier boards, memory,...) to your request?

Value adding ecosystem offerings

Cooling solutions

Carrierboards

Specification

Formfactor
Qseven
CPU
NXP i.MX8 Quad Max (4, ARM Cortex-A53, 2x ARM Cortex-A72, 2x ARM Cortex-M4F, 15W)
NXP i.MX8 QuadPlus (4, ARM Cortex-A53, 1x ARM Cortex-A72, 2x ARM Cortex-M4F)
DRAM
Up to 8 GByte onboard LPDDR4 memory | 3200 MT/s
Ethernet
Gigabit Ethernet
I/O Interfaces
4 x USB 2.0 (shared with 1x USB OTG client)
1 x USB 3.0
1 x SATA III (6Gb/s)
1 x SDIO
2 x PCI Express™ 3.0 lanes
I²C bus
CAN Bus
SPI
2 x UART
Graphics
Integrated in NXP i.MX8 Series dual GT7000 multimedia GPU
VPU (4K h.265 dec / HD h.264 enc) | 2D Graphics (GPU2D) and 3D Graphics (GPU3D) | 3D graphics with 4 shaders up to 200MT/s 2 independent displays | dual stream 1080p/720p decoder/encoder | OpenGL 3.1 | Vulcan | VX extensions | OpenCL 2.0
Operating Systems
Android
Linux
Yocto
Temperature
Extended
Commercial : Operating: 0 to +60°C Storage: -20 to +70°C Industrial: Operating: -40 to +85°C Storage: -40 to +85°C
Humidity
Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.
Size
70 x 70 mm (2,75" x 2,75")

Documents

All documents found on this page are updated without notification. Always check this page forthe latestversion.

Data Sheet

29.05.2020

Software

[ Android ]      [ yocto ]     

Android

In order to fetch and build the Yocto-/Android-BSP for conga-QMX8, please follow:
https://wiki.congatec.com/display/IMX8DOC/BSPs+conga-QMX8

yocto

In order to fetch and build the Yocto-/Android-BSP for conga-QMX8, please follow:
https://wiki.congatec.com/display/IMX8DOC/BSPs+conga-QMX8

Product Variants

conga-QMX8/QCM-4GB eMMC16 (P/N 016400)

Qseven module with high-performance NXP i.MX8 Quad Max processor with 2x ARM® Cortex®-A72, 4x ARM® Cortex®-A53 and 2x ARM® Cortex®-M4F, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Lidded package. Commercial temperature range.

conga-QMX8/QCP-2GB eMMC16 (P/N 016403)

Qseven module with high performance NXP i.MX 8QuadPlus processor with 1x ARM Cortex-A72, 4x ARM Cortex-A53 and 2x ARM Cortex-M4F, 2GB onboard LPDDR4 memory and 16GB onboard eMMC. Commercial temperature range.

conga-QMX8/QCP-4GB eMMC16 (P/N 016401)

Qseven module with high-performance NXP i.MX8 Quad Plus processor with 1x ARM® Cortex®-A72, 4x ARM® Cortex®-A53 and 2x ARM® Cortex®-M4F, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Lidded package. Commercial temperature range.

conga-QMX8/i-QCM-4GB eMMC16 (P/N 016421)

Qseven module with high-performance NXP i.MX8 Quad Max processor with 2x ARM® Cortex®-A72, 4x ARM® Cortex®-A53 and 2x ARM® Cortex®-M4F, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Lidded package. Industrial temperature range.

conga-QMX8/i-QCP-2GB eMMC16 (P/N 016424)

Qseven module with high performance NXP i.MX 8QuadPlus processor with 1x ARM Cortex-A72, 4x ARM Cortex-A53 and 2x ARM Cortex-M4F, 2GB onboard LPDDR4 memory and 16GB onboard eMMC. Industrial temperature range.

conga-QMX8/i-QCP-4GB eMMC16 (P/N 016422)

Qseven module with high-performance NXP i.MX8 Quad Plus processor with 1x ARM® Cortex®-A72, 4x ARM® Cortex®-A53 and 2x ARM® Cortex®-M4F, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Lidded package. Industrial temperature range.

Ecosystem Details

Cooling solutions

conga-QMX8/CSP-B (P/N 016450)

Passive cooling solution for Qseven module conga-QMX8 with lidded NXP i.MX8 ARM Cortex® A72 processor. All standoffs are M2.5mm thread.

conga-QMX8/CSP-T (P/N 016451)

Passive cooling solution for Qseven module conga-QMX8 with lidded NXP i.MX8 ARM processor. All standoffs are M2.5mm thread.

conga-QMX8/HSP-B (P/N 016452)

Standard heatspreader for Qseven module conga-QMX8 with lidded NXP i.MX8 ARM Cortex® A72 processor. All standoffs are M2.5mm thread.

conga-QMX8/HSP-T (P/N 016453)

Standard heatspreader for Qseven module conga-QMX8 with lidded NXP i.MX8 ARM Cortex® A72 processor. All standoffs are with 2.7mm bore hole.

Carrierboards

conga-QEVAL/Qseven 2.0 ARM (P/N 007005)

Evaluation carrier board for Qseven 2.0 modules based on ARM architecture.

Accessories

More about conga-MCB/Qseven-ARM

conga-MCB/Qseven-ARM

The conga-MCB/ARM is a full featured carrier board for Qseven ARM modules.

More about conga-QEVAL/Qseven 2.0

conga-QEVAL/Qseven 2.0

To achieve a quick start with Qseven congatec offers an evaluation carrier board, which routes all the Qseven® signals to standard interface connectors.