San Diego, CA, July 23, 2026 * * * congatec – a leading provider of embedded and edge computing technology – today introduced its new COM-HPC Client Size C module with AMD Ryzen™ AI Embedded X100 Series processors. The application-ready aReady.COM conga-HPC/cRX1 has been specifically designed for compute-intensive physical AI applications. Featuring up to 16 AMD “Zen 5” CPU cores, up to 40 compute units of the integrated AMD Radeon RDNA 3.5 GPU, and a dedicated NPU, conga-HPC/cRX1 sets a new performance benchmark for COM-HPC Client modules. Its high, integrated AI and FP32 compute performance eliminates the need for discrete AI accelerator cards in many target applications. Combining outstanding compute performance, extensive I/O bandwidth, and support for industrial temperatures ranging from -40°C to +85°C, the module is ideally suited for physical AI applications that consolidate perception, intelligence, and actuation to executecomplex tasks in dynamic operating environments. Typical application areas include robotics, autonomous commercial vehicles for smart farming, logistics, and forestry, as well as medical technology and industrial automation.
The COM-HPC module, part of the AMD Kria™ AI SOM portfolio, leverages the new AMD Ryzen AI Embedded X100 series with up to 16 “Zen 5” CPU cores for time-critical, sequential workloads such as real-time control, sensor fusion, planning, and decision-making. The integrated GPU delivers up to 59 TOPS of dense INT8 AI inference performance and up to 29.7 TFLOPS of FP32 compute performance, accelerating highly parallel workloads such as perception and object detection in collaborative robots and autonomous vehicles. It also enables the local execution of Large Language Models (LLMs). The dedicated NPU additionally provides up to 50 TOPS of AI performance for always-on AI workloads such as object detection and recognition, speech recognition, and image processing. Based on scalable Computer-on-Module (COM) technology, congatec’s solutions enable modular, rugged embedded platforms with long-term availability that combine low system complexity with highest computing performance.
“Physical AI applications are placing ever-increasing demands on embedded systems,” said Florian Drittenthaler, product line manager at congatec. “Our conga-HPC/cRX1, powered by AMD Ryzen AI Embedded X100 Series processors, delivers the highest performance currently available in a COM-HPC Client module. This enables OEMs to eliminate the need for discrete AI accelerator cards in many applications, allowing them to develop more compact, energy-efficient, reliable, and cost-effective embedded edge systems with a lower total cost of ownership.”
“The next wave of embedded innovation will be defined by delivering more intelligence in smaller, more power-efficient designs,” said Sumit Shah, head of product management and marketing, Adaptive and Embedded Computing Group, AMD. “AMD Ryzen AI Embedded X100 Series processors integrate CPU, GPU, and NPU capabilities into a single platform – reducing system complexity while delivering deterministic performance and the efficiency required for real-world AI at the edge.”
The Features in Detail
conga-HPC/cRX1 is available in the COM-HPC Client Size C form factor, measuring 120 mm × 160 mm, and supports the industrial temperature range from -40°C to +85°C, making it suitable for deployment in harsh operating environments. With a base TDP of 55 W, the module can be configured across a wide TDP range from 45 W for optimized power efficiency up to 120 W for maximum performance. The AMD Ryzen AI Embedded X100 Series processors feature up to 16 AMD “Zen 5” CPU cores operating at clock frequencies of up to 5.1 GHz. The integrated AMD Radeon RDNA 3.5 iGPU supports up to four independent 4K displays, while the dedicated AMD XDNA 2 NPU delivers up to 50 TOPS of AI performance for highly efficient parallel AI computing.
Memory-intensive applications benefit from up to 128 GB of LPDDR5X-8533 unified memory, which enables efficient data sharing between the compute engines. This reduces latency while simplifying system design. The memory is also soldered to increase the module's robustness against shock and vibration. The capacity and high bandwidth of the unified memory accelerate general-purpose GPU (GPGPU) workloads, which benefit from high data throughput between memory and compute engines. Additionally, up to 512 GB of optional on-board NVMe storage provides fast data access and short loading times. To connect expansion devices, the module offers up to 24 PCIe Gen4 lanes, enabling straightforward integration of numerous low-lane devices such as industrial Ethernet interfaces, fieldbus adapters, or wireless communication modules. Additional interfaces include 2x 2.5 GbE, up to 4x USB 3.2 Gen2, up to 8x USB 2.0, up to 2x SATA 6 Gb/s, 2x I²C, 2x UART, 12x GPIO, 1x SMBus, and 1x SPI. The module has been developed in accordance with IEC 62443-4-1. This helps OEMs meet cybersecurity requirements and simplifies their preparations for the EU’s Cyber Resilience Act, which will take effect in December 2027. Additional integrated security is provided by a Trusted Platform Module (TPM 2.0). To accelerate the development and deployment of AI applications, the comprehensive AMD ROCm open-source software stack provides developers with a powerful platform for AI and high-performance computing workloads.
conga-HPC/cRX1’s supported operating systems include Microsoft Windows 11, Windows 11 IoT Enterprise, and Linux. As an application-ready aReady.COM module, conga-HPC/cRX1 is also available preconfigured with licensed ctrlX OS, Ubuntu Pro, or KontronOS operating systems. The aReady.VT option, which features integrated conga-zones hypervisor and virtualization technologies, enables developers to consolidate multiple workloads – such as real-time control, HMI, AI, and IoT gateway functions – onto a single module. For IIoT connectivity, congatec offers aReady.IOT software building blocks, which includes conga-connect for enabling data exchange, remote maintenance, and management of the module, carrier boards, and peripherals as needed. To further simplify application development, congatec offers a comprehensive supporting ecosystem that includes evaluation and application carrier boards, customized cooling solutions, documentation, design-in services, and high-speed signal integrity measurements. With aReady.YOURS, OEMs can also leverage congatec’s extensive hardware and software customization services to obtain turnkey-level embedded computing platforms that include advanced cooling solutions.
The new conga-HPC/cRX1 processor variants at a glance:
| Model | Cores / Threads | Graphics Execution Units | Clock Frequency (max. boost) | Base TDP (configurable) | Operating Temperature |
|---|---|---|---|---|---|
| AMD Ryzen AI Embedded X199 | 16 / 32 | 40 | 5.1 GHz | 55 W (45–120 W) | 0 to +60°C |
| AMD Ryzen AI Embedded X188 | 12 / 24 | 32 | 5.0 GHz | 55 W (45–120 W) | 0 to +60°C |
| AMD Ryzen AI Embedded X168 | 8 / 16 | 32 | 5.0 GHz | 55 W (45–120 W) | 0 to +60°C |
| AMD Ryzen AI Embedded X199i | 16 / 32 | 40 | 5.1 GHz | 55 W (45–120 W) | -40 to +85°C |
| AMD Ryzen AI Embedded X188i | 12 / 24 | 32 | 5.0 GHz | 55 W (45–120 W) | -40 to +85°C |
| AMD Ryzen AI Embedded X168i | 8 / 16 | 32 | 5.0 GHz | 55 W (45–120 W) | -40 to +85°C |
Further information on the new conga-HPC/cRX1 Computer-on-Modules:Visit Product Page
Further information on the AMD Ryzen™ AI Embedded X100 Series processors:Visit Technology Page
