21일 - 임베디드 및 에지 컴퓨팅 기술분야의 선도 기업 콩가텍( www.congatec.com )이 COM 익스프레스콤팩트(Express Compact) 타입 6 모듈인 conga-TC675r 이극한의 온도, 습도, 충격및 진동에 대한 세계최고 수준의 환경 테스트IEC 60068를통과했다고 밝혔다.…
we consistently play a leadership role in application-ready COM building blocks, which include modules, carriers, and thermal management. We’re actively engaged in open standards, …
PCI Express Gen 4 | USB 4 Industrial Temperature Range -40°C to +85°C Press Release Specification Formfactor COM-HPC CPU Qualcomm [...] for COM-HPC module conga-HPC/mIQX. All…
installation demonstrating secure connectivity from the COM to the cloud. This platform enables seamless communication with machines, systems, and sensors via widely used…
conga-bID7 formerly JUMPtec COMe-bID7 COMExpress® basic Type 7 with Intel® Xeon® D-1700 / D-1800 processor family Learn all about COMs - download the guide Intel [...] 4x 10G-KR…
conga-cRP6 formerly JUMPtec COMe-cRP6 COMExpress® Compact Type 6 with 13th Generation Intel® Core™ Processors Learn all about COMs - download the guide 13th [...] onboard…
