Simplifying the use of embedded technology – congatec @ Electronex 2026
June 3rd & 4th
Let’s meet at ElectroneX 2026, in Sydney, Australia June 3rd and 4th.
In 2026, we’re going bigger! Following our investment in JUMPtec - the former module business of Kontron AG - you will find even more modules, application examples and services at our booth.
Visit congatec and experience our application-ready embedded computing portfolio - combining aReady. Computer-on-Modules, software, and services into one coherent ecosystem.
Our hardware buildings block based on COM-HPC, COM Express, and SMARC, along with software and service building blocks, are an integral part of our aReady. strategy, enabling smarter, more energy-efficient, future-ready, and secure embedded systems.
This is what you can expect at our booth:
Here is what we can tell you so far…
New Intel® Core™ Ultra Series 3 modules
Our ecosystem is extended with the industry’s broadest portfolio of Computer-on-Modules based on Intel® Core™ Ultra Series 3 (Panther Lake), delivering up to 180 TOPS of integrated AI acceleration with strong power efficiency for embedded applications.
High-performance Arm ecosystem
Our Arm ecosystem is extended with our first COM-HPC Mini featuring Qualcomm Dragonwing IQ-X, offering exceptional AI performance and power efficiency for edge applications.
Efficient entry into rugged embedded edge AI
congatec launches COM Express Compact module based on the latest AMD Ryzen™ AI Embedded P100 processor series.
Application-ready hardware and software building blocks simplifying AI, IoT, and security integration for faster time-to-market.
From modular building blocks to fully-certified systems – designed with trusted partners.
Explore now
Register Now
Click on the link below to register for this event:
