Simplifying the use of embedded technology – congatec @ Electronex 2026
June 3rd & 4th
Let’s meet at ElectroneX 2026, in Sydney, Australia June 3rd and 4th.
Our focus this year is our aReady. portfolio - a comprehensive ecosystem of embedded hardware and software building blocks, and tailored services. Visit us at our booth to discover how this application-ready approach simplifies design-in complexity and accelerates your time-to-market by providing a unified, pre-validated foundation for your edge applications.
Our hardware buildings block based on COM-HPC, COM Express, and SMARC, along with software and service building blocks, are an integral part of our aReady. strategy, enabling smarter, more energy-efficient, future-ready, and secure embedded systems.
This is what you can expect at our booth
Here is what we can tell you so far…
New Intel® Core™ Ultra Series 3 modules
Our ecosystem is extended with the industry’s broadest portfolio of Computer-on-Modules based on Intel® Core™ Ultra Series 3 (Panther Lake), delivering up to 180 TOPS of integrated AI acceleration with strong power efficiency for embedded applications.
Our Arm ecosystem is extended with our first COM-HPC Mini featuring Qualcomm Dragonwing IQ-X, offering exceptional AI performance and power efficiency for edge applications.
congatec launches COM Express Compact module based on the latest AMD Ryzen™ AI Embedded P100 processor series.
Application-ready hardware and software building blocks simplifying AI, IoT, and security integration for faster time-to-market.
From modular building blocks to fully-certified systems – designed with trusted partners.
Explore now
Register Now
Click on the link below to register for this event:
Got questions? Let’s talk.
Get in touch with our experts to find the right solution