Qseven 2.0 module based on AMD Embedded GX-210HA SOC with AMD Radeon™ HD 8210E Graphics (TDP 9W) with on-board memory 2GB ECC DDR3L-1333
conga-QG
高性能、低消費電力 AMD 組込GシリーズSOC プラットフォームのQsevenモジュール高性能、低消費電力
- 高性能、低消費電力 AMD 組込GシリーズSOC プラットファームのQsevenモジュール
- オンボードECCメモリ(オプション)と工業用温度範囲対応で環境の厳しいアプリケーションに最適
Specification
Documents
Manual
Data Sheet
Software
Use for BIOS update or customization and panel configuration.Linux source version.
Use for BIOS update or customization and panel configuration.Linux source version.
Use for BIOS update or customization and panel configuration.
Use for BIOS update or customization and panel configuration.
Use for BIOS update or customization and panel configuration.
Use for BIOS update or customization and panel configuration.
Use for BIOS update or customization and panel configuration.
Product Variants
Qseven 2.0 module based on AMD Embedded GX-210HA SOC with AMD Radeon™ HD 8210E Graphics (TDP 9W) with on-board memory 2GB ECC DDR3L-1333 and 4GB MLC SATA Solid State Disk.
Qseven 2.0 module based on AMD Embedded GX-210JA SOC with AMD Radeon™ HD 8180E Graphics (TDP 6W) with on-board memory 2GB ECC DDR3L-1066
Qseven 2.0 module based on AMD Embedded GX-212JC SOC with AMD Radeon™ Graphics (Dual-core, 6W TDP, CPU freq. 1.2/1.4GHz, GPU freq. 351MHz) with on-board memory 2GB ECC DDR3L-1333
Qseven 2.0 module based on AMD Embedded GX-412HC SOC with AMD Radeon™ Graphics (Quad-core, 7W TDP, CPU freq. 1.2/1.6GHz, GPU freq. 400MHz) with on-board memory 4GB ECC DDR3L-1333
Ecosystem Details
Cooling solutions
Standard heatspreader for Qseven module conga-QG
Standard heatspreader for Qseven module conga-QG. All standoffs are with 2.7mm bore hole.
Passive cooling solution for Qseven module conga-QG. All standoffs are M2.5mm thread.
Passive cooling solution for Qseven module conga-QG. All standoffs are with 2.7mm bore hole.
Accessories
conga-QEVAL/Qseven 2.0
Qseven を使った開発をすぐに始められるように、すべての Qseven 信号を標準のインタフェースコネクタに出力する評価キャリアボード
conga-LDVI
LVDSからDVIへ変更モジュール