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conga-BS67 (EOL)
Module COM Express™ à haute performance basique de type 2 avec des processeurs Intel® Core™ i7 à basse consommation soudés
- Module COM Express basique de type 2 à haute performance
- Processeur faible consommation jusqu’à Intel® Core™ i7 2,2 GHz
- Solution de refroidissement basée sur des caloducs
Specification
Processor integrated Mobile Intel® 6 Series HD graphics, OpenGL 3.0 and DirectX 10.1 support, Two independent pipelines for full dual view support, High performance hardware MPEG-2 decoding, WMV9 (VC-1) and H.264 (AVC) support Blu-ray support @ 40 Mbit/s, hardware motion compensation, no PEG support
It is capable of calculating efficient hash and RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e commerce will benefit also with improved authentication, integrity and confidence levels.
ACPI 3.0 compliant, Smart Battery Management
Operating: 0 to +60°C Storage: -20 to +80°C
Documents
Application Note
Manual
Image
Data Sheet
Software
Product Variants
Ecosystem Details
Memory
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 8GB RAM.
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 4GB RAM.
DDR3L SODIMM memory module with 1600MT/s (PC3L-12800S) and 2GB RAM.
Cooling solutions
Standard heatspreader for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes. All stand-offs are M2.5mm threaded.
Standard heatspreader for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes. All stand-offs are with 2.7mm bore hole.
Standard passive cooling solution for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All stand-offs are M2.5mm threaded.
Standard passive cooling solution for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All stand-offs are with 2.7mm bore hole.
Standard active cooling solution for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height and integrated 12V fan. All stand-offs are M2.5mm threaded.
Standard active cooling solution for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height and integrated 12V fan. All stand-offs are with 2.7mm bore hole.
Accessories
conga-CKIT (EOL)
Ce kit complet permet de démarrer immédiatement l’évaluation des modules COM Express™ de type 2.
conga-CEVAL (EOL)
Carte porteuse d’évaluation pour les modules COM Express® basés sur la définition de brochage de type 2. Carte porteuse d’évaluation pour les modules COM Express® basés sur la définition de brochage de type 2.
conga-Cdebug (EOL)
Plateforme de débogage COM Express® pour les cartes porteuses et les modules de type 2
conga-LDVI
Module convertisseur DVI pour LVDS