Join us in Shanghai at CIIF China, the leading trade show for emerging and high-end industries, from 23 September to 27 September. At our booth, 6.1H-B037, we’ll be showcasing our latest innovations and application-ready building blocks designed to simplify the use of embedded technology in your cutting-edge solutions and accelerate your time-to-market.

Discover our high-performance ecosystems for COM-HPC, COM Express, and SMARC, which are designed to make your next-gen applications faster, safer, and more sustainable.  Learn in our interactive game how our aReady.COM ecosystem provides you with pre-configured hardware and software building blocks that help you to significantly increase efficiency, agility, security and cost-efficiency.