Qualcomm Dragonwing IQ-X
COM-HPC Mini modules with Dragonwing IQ-X series processors
Arm on COM-HPC delivers unique capabilities
Highest-performance-per-watt for Demanding Edge AI Applications
On COM-HPC Mini, the Qualcomm® Oryon™ CPU with up to 12 cores offers exceptional single- and multi-thread performance. The powerful Qualcomm ® Hexagon™ NPU adds up to 45 TOPS of AI performance, enabling real-time decisions without cloud dependency. It also eliminates the need for discrete accelerators, which helps to significantly reduce system cost and power consumption. The integrated Qualcomm® Spectra™ Image Signal Processor (ISP) and Qualcomm® Hexagon™ DSP low-power audio subsystem (LPASS) provide ultra-efficient processing capabilities for video, image, and audio data. Furthermore, the integrated Qualcomm ® Adreno™ GPU delivers powerful graphics and supports up to three displays and 8K resolution.
Efficiency and ruggedness without compromise
The Qualcomm Dragonwing processor series is designed as a system-in-package (SiP), integrating up to 64 GB efficient and ultra-fast soldered LPDDR5x memory with 8,400 MT/s. It also offers broad scalability from 15 to 45 W TDP. Supporting Windows on Arm creates new opportunities where Arm and x86 environments converge. This is supported by rich connectivity options including USB4, PCIe Gen 4, two CSI inputs for 4-lane cameras with up to 36 MP @ 30 fps, and UFS 4.0 support for up to 1 TB of fast storage.
Featuring soldered RAM and an extended operating temperature range of -40 °C to +85 °C, modules based on Qualcomm's Dragonwing IQ-X processors are ideal for Size, Weight, and Power (SWaP) optimized edge applications in harsh conditions. Moreover, the high performance-per-watt reduces power demands and simplifies thermal management. This significantly reduces design-in efforts and overall operating costs. Such platforms are therefore ideal for high-end applications such as robotics, factory automation, medical devices, panel PCs, human-machine interfaces (HMIs), smart surveillance, and retail.
Facts, Benefits & Features
| Facts | Features | Benefits |
|---|---|---|
| High-performance Arm CPU | Powerful Qualcomm Oryon CPU with up to 12 cores | Achieve high single- and multi-thread performance for demanding workloads in industrial applications, previously only possible with x86 technology, but now with the performance-per-watt efficiency of the Arm architecture. |
| Dedicated AI accelerator | Fully integrated Qualcomm Hexagon NPU | Benefit from up to 45 TOPS of AI acceleration for high-performance AI applications. Run LLMs and ML locally to boost responsiveness in cloud-independent edge installations. Significantly reduce the bill of materials (BOM) and costs of your designs, as discrete AI accelerators are not required. |
| Optimized AI software support | Qualcomm® AI Stack | Easy AI model porting for deploying intelligent edge solutions at scale with the Qualcomm AI Software Stack and common runtimes such as ONNX and PyTorch.. |
| Industrial temperature support | Modules with Qualcomm Dragonwing IQ-X processors reliably operate in the industrial temperature range of -40 °C to +85 °C. | Enables reliable operation of mission critical applications even in the most demanding environments. Applications include drones, autonomous vehicles, industrial automation, mobile medical systems, outdoor video surveillance and many more. |
| Windows support | Qualcomm Dragonwing IQ-X processor-based modules support Windows on Arm. | Combines the inherent high energy efficiency of Arm with powerful hardware with high compatibility and an extensive software ecosystem for Windows 11 IoT Enterprise LTSC to run your applications. |
| UEFI instead of bootloader | AMI Aptio® V UEFI firmware for Arm | Designers benefit from the standardized, extensible firmware interface that unifies boot, device initialization, security, and configuration, enabling consistent workflows and tooling independent of the underlying Arm SoC platform. This significantly simplifies OS compatibility and reduces development effort improving security and time-to-market. |
| High-performance ISP and DSP | Qualcomm® Spectra™ Image Signal Processor and Hexagon™ DSP | Precise image capture and processing for inspection, quality assurance, and safety applications. This enables highly efficient AI-accelerated computer vision solutions with “always-on” camera and sensor support for video surveillance, mobile medical imaging, and transactional retail installations. |
Typical application areas
Rugged IPCs And Mission Computer
The superior performance-per-watt, a fully soldered down design, plus support for the industrial temperature range from -40 °C to +85 °C make the platform an ideal basis for fully rugged edge devices in the harshest environments.
Autonomous Mobile Robots (AMR)
High efficiency, real-time perception, and robust thermal tolerance support reliable navigation, obstacle avoidance and fleet coordination in warehouses, factories, and outdoor environments.
Mobile Medical Devices & Diagnostics
High-performance edge AI accelerates imaging, sensor analysis and patient monitoring directly on the device. Real-time processing enables medical PCs to deliver fast diagnostics, smooth clinical workflows, and dependable operation.
Transactional Retail & Check-Out Systems
With up to 45 TOPS of AI performance, item recognition at the checkout is fast and accurate. Thanks to the high multithread performance of the Qualcomm Dragonwing IQ-X processors self-checkout-systems can handle even the most demanding transaction processing and system management tasks.
Quality Inspection Systems
Powerful image processing capabilities, enabled by advanced image signal processors (ISPs) and local machine learning, allow adaptive quality systems to autonomously adapt to new parameters, thereby improving productivity and reliability.
Smart Surveillance Systems
Advanced on-device AI inference without additional accelerators enables rapid image, pattern, and anomaly detection, ideal for quality inspection, optical sorting, and safety monitoring where every millisecond matters.
Check out our Computer-on-Modules
Based on the Qualcomm Dragonwing IQ-X processor series
conga-HPC/3.5-Mini
- Compact Application Carrier for COM-HPC Mini Modules
- Scalable 3.5” motherboard
- Longevity by module concept
- Quick start for COM-HPC Mini designs
Further relevant media
Everything you need to know about COMs
Computer-on-Modules (COMs) power everything from robotics and medical devices to edge computing and smart mobility. But what makes them so versatile? And which standard is right for your needs? Explore the answers in our comprehensive guide to COMs.
