Recherche - congatec

Communiqués de presse congatec étend les tests ferroviaires à sa gamme de modules COM Express

les conditions environnementales extrêmes — pour le module COM Express Compact Type 6 conga-TC675r . Le conga-TC675r est un module embarqué compact, prêt à l'emploi et d'une…

/fr/congatec/communiques-de-presse/article/congatec-etend-les-tests-ferroviaires-a-sa-gamme-de-modules-com-express/ 21.10.2025

Pages congatec – Order Overview for Embedded Computer on Modules

Here are some of our latest high performance products that might interest you:

/fr/products/order-overview/ 23.10.2026

Communiqués de presse congatec’s new COM Express Mini module with Intel Apollo Lake processors

and extended temperature range in the credit card sized COM Express Mini form factor. The new COM Express Type 10 Computer-on-Modules are equipped with the latest Intel® Atom™, …

/fr/congatec/communiques-de-presse/article/congatecs-new-com-express-mini-module-with-intel-apollo-lake-processors/ 15.10.2018

Communiqués de presse congatec’s smart cooling pipes pave the way for unlimited performance growth for COM Express modules

which are integrated in the standardized heatspreader of the COM Express specification. With this solution it becomes possible to cool next generation high-performance processors…

/fr/congatec/communiques-de-presse/article/congatecs-smart-cooling-pipes-pave-the-way-for-unlimited-performance-growth-for-com-express-modules/ 15.10.2018

Communiqués de presse embedded world China preview: congatec to present application-ready ecosystems from servers to low-power systems

with an extensively expanded range of functions of our COM‑HPC, COM Express, SMARC, and Qseven-based modules. For example, module-integrated hypervisor technology and IIoT…

/fr/congatec/communiques-de-presse/article/embedded-world-china-preview-congatec-to-present-application-ready-ecosystems-from-servers-to-low-power-systems/ 04.06.2024

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Description HEVA-LEK1v1_IO 065550 I/O shield standard size for COM-HPC server carrier board with 40 mm height for LEK1v1 HEVA-LEK1v2_IO 065551 I/O shield standard size for COM-HPC…

PDF – 1 Mo 12.08.2025

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You can find the specific details at https://www.congatec.com/en/ licenses/. Enter the following command “license” in the bootloader to get the complete product related license …

PDF – 4 Mo 21.11.2025

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, refer to the User's Guide available at www.congatec.com http://www.congatec.com https://git.congatec.com…

PDF – 607 Ko 29.10.2024

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PDF – 3 Mo 22.07.2026

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x86 SoCs. The SMARC standard bridges the gap between the COM Express standard and the Qseven standard by offering most of the interfaces defined in the COM Express specification…

PDF – 2 Mo 20.08.2026