Recherche - congatec

Pages Rugged Embedded Computing for Harsh Environments | congatec

operation. Available in multiple form factors such as COM-HPC, COM Express, SMARC, and Qseven, congatec rugged modules enable scalable system designs across industrial automation…

/fr/products/rugged-embedded-computing/ 23.10.2026

Fichiers User's Guide for conga-GEVAL

PDF – 5 Mo 26.02.2026

Communiqués de presse Extraordinary AI performance from -40 to +85 °C for rugged applications

the highest data-throughput with PCIe Gen 5 and USB4, the COM-HPC Mini conga-HPC/mPTL and COM-HPC Client conga-HPC/cPTL modules deliver extreme performance and I/O bandwidth. For…

/fr/congatec/communiques-de-presse/article/extraordinary-ai-performance-from-40-to-85-c-for-rugged-applications/ 31.03.2026

Communiqués de presse conga-HPC/cBLS accélère les projets périphériques exigeants

les limites de performance de ses Computer-on-Modules (COM) COM-HPC Client Taille C conga-HPC/cBLS , avec de nouveaux variants Intel® Core™ Series 2 (nom de code : Bartlett Lake-S…

/fr/congatec/communiques-de-presse/article/conga-hpc-cbls-accelerates-demanding-edge-designs/ 01.04.2026

Produits conga-HPC/cRX1

conga-HPC/cRX1 COM-HPC Client Size C module based on AMD Ryzen™ AI Embedded X100 Series Learn all about COMs - download the guide [...] height. Standoffs are with 2.7mm borehole.…

https://www.congatec.com/fr/produits/com-hpc/conga-hpccrx1/ 09.11.2026

Pages COM-HPC Client Size C Module with AMD Ryzen™ AI Embedded X100 Series Processors

COM-HPC Client Size C Module with AMD Ryzen™ AI Embedded X100 Series Processors Maximum edge and physical AI performance [...] Further relevant media Everything you need to know…

/fr/technologies/com-hpc-client-size-c-module-with-amd-ryzentm-ai-embedded-x100-series-processors/ 07.11.2026

Communiqués de presse Module haute performance pour les applications d’IA physique dans des environnements edge résilients

edge computing — a présenté aujourd’hui son nouveau module COM-HPC Client Size C équipé de processeurs AMD Ryzen™ AI Embedded de la série X100. Le module aReady.COM conga-HPC/cRX1,…

/fr/congatec/communiques-de-presse/article/module-haute-performance-pour-les-applications-dia-physique-dans-des-environnements-edge-resilients/ 23.07.2026

Pages Embedded World India

edge applications. Our hardware buildings block based on COM-HPC , COM Express , and SMARC , along with software and service building blocks, are an integral part of our aReady. …

/fr/congatec/events/embedded-world-india/ 04.11.2026

Pages Card Variants

these best practices how to maximize IT/OT connectivity from COM to cloud using our high-performance Computer-on-Modules. Check use cases COM-HPC Your best choice for new…

/fr/bgm-demo-seiten/card-variants/ 26.10.2026

Pages Tabellen

standards Support of the high-performance PICMG standards COM-HPC and COM Express as well as the low-power SGeT standard SMARC Broad support from a huge community and multiple…

/fr/bgm-demo-seiten/demoelemente-facelift/tabellen/ 23.10.2026