Recherche

Fichiers Datasheet conga-TEVAL/COMe 3.1

PowerPoint-Präsentation www.congatec.com conga-TEVAL3/COMe 3.1 Board Type Evaluation Carrier Board for COM Express® Type 6 Modules Rev. 3.1 Internal IO PCIe Gen4 [...] socket…

PDF – 108 Ko 27.11.2024

Fichiers Datasheet conga-XAF

www.congatec.com Formfactor ETX® Spec 2.7. without ISA Support | XTX™ Extensions CPU AMD G-T56N 1.6 GHz Dual Core L1 cache 64KB L2 cache [...] Express Card LPC Bus | I²C (Fast Mode…

PDF – 917 Ko 29.10.2024

Fichiers User's Guide for conga-IC175

technical support department by email at support@congatec.com Terminology Term Description PCIe Peripheral Component Interface Express cBC congatec Board Controller SDIO Secure …

PDF – 3 Mo 29.10.2024

Fichiers User's Guide for conga-HPC/uATX-Server

components, features and connectors available on the congatec COM-HPC carrier board. It is one of the documents that should be referred to when designing a COM Express™…

PDF – 4 Mo 07.07.2025

Communiqués de presse Combined expertise for embedded Computer-on-Module integration

easier access to a broader range of Computer-on-Modules (COMs), including application-ready software building blocks and full system integration services. As part of the…

/fr/congatec/communiques-de-presse/article/combined-expertise-for-embedded-computer-on-module-integration/ 23.09.2025

Pages Technologie XTX

les applications ATX qui ne nécessitent pas ISA par des COM ayant un facteur d’encombrement identique et une rétrocompatibilité totale pour permettre l’utilisation de technologies…

/fr/technologies/xtx/ 26.10.2026

Communiqués de presse congatec presents its aReady.COM solutions at CIIF 2025

One of the key highlights is the high-performance aReady.COM ecosystem, including pre-installed, application-ready software building blocks significantly simplifying application …

/fr/congatec/communiques-de-presse/article/congatec-presents-its-areadycom-solutions-at-ciif-2025/ 10.09.2025

Pages 11 bonnes raisons pour choisir la 11e génération

nouveaux processeurs disponibles sur les Computer-on-Modules COM-HPC de taille A et COM Express Compact. Que propose cette nouvelle génération de processeurs Intel® Core™ ? Ce…

/fr/technologies/11-bonnes-raisons-pour-choisir-la-11e-generation/ 26.10.2026

Pages 12th Gen Intel Core Computer-on-Modules

on the high-performance Computer-on-Module standards COM-HPC and COM Express. Featuring an innovative performance hybrid architecture, the new high-end embedded processors,

/fr/technologies/12th-gen-intel-core-computer-on-modules/ 23.10.2026

Communiqués de presse Cooperation between congatec and SSV

bold start, congatec was able to establish itself on the COM market (Computer-on-Module) within a very short period of time and with XTX (eXpress Technology for ETX ® ) was able…

/fr/congatec/communiques-de-presse/article/cooperation-between-congatec-and-ssv/ 15.10.2018