Ricerca - congatec

Comunicati stampa congatec presenta: Moduli di COM Express con processore Intel ® Celeron ® dual-core per la 3 ° generazione di processori Intel ® Core ™

per la conga-TS77 (tipo 6) e conga-BS77 (tipo 2) i moduli COM Express. I moduli forniscono ottime prestazioni e una migliore efficienza energetica a un prezzo basso. I moduli di …

/it/congatec/comunicato-stampa/article/congatec-presenta-moduli-di-com-express-con-processore-intel-r-celeron-r-dual-core-per-la-3-generazione-di-processori-intel-r-core-tm/ 27.04.2021

Comunicati stampa congatec presents 12 Computer-on-Modules with 11th Gen Intel® Core™ processors

support and is creating a COM Express vs COM-HPC design decision guide. This is available for download on the product pages of the conga HPC/cTLU COM-HPC Client module and the…

/it/congatec/comunicato-stampa/article/congatec-presents-12-computer-on-modules-with-11th-gen-intelr-coretm-processors/ 23.09.2020

Comunicati stampa congatec presents 8th Gen Intel® Core™ Mobile processors on embedded form factors

SBCs, conga-IC370 Thin Mini-ITX motherboards and conga-TC370 COM Express Type 6 modules all come with the 1.8 GHz quad-core Intel Core i7-8565U Mobile processor that impresses with…

/it/congatec/comunicato-stampa/article/congatec-presents-8th-gen-intelr-coretm-mobile-processors-on-embedded-form-factors/ 28.02.2019

Comunicati stampa congatec presents Intel® IoT RFP Kit for workload consolidation in vision based situational awareness applications

as Intel ® IoT RFP (Ready For Production) Kit. Based on a COM Express Type 6 module equipped with Intel ® Xeon ® E2 processor, the RFP kit has three virtual machines (VMs) built…

/it/congatec/comunicato-stampa/article/congatec-presents-intelr-iot-rfp-kit-for-workload-consolidation-in-vision-based-situational-awareness-applications/ 16.06.2020

Comunicati stampa congatec presents an APIX starter kit for the development of robust and inexpensive control units

Nuremberg, Germany, SPS/IPC/Drives, 24 November 2009 * * * congatec AG will be presenting a starter kit for APIX technology at SPS/IPC/Drives. APIX was originally developed for…

/it/congatec/comunicato-stampa/article/congatec-presents-an-apix-starter-kit-for-the-development-of-robust-and-inexpensive-control-units/ 15.10.2018

Comunicati stampa congatec presents edge computing platforms with TSN support for real-time factories

the formerly codenamed Tiger Lake H portfolio. These new COM Express Type 6 and COM-HPC Client Computer-on-Modules with 11th Gen Intel Core vPro, Intel Xeon W-11000E, and Intel …

/it/congatec/comunicato-stampa/article/congatec-presents-edge-computing-platforms-with-tsn-support-for-real-time-factories/ 08.09.2021

Comunicati stampa congatec presents embedded computer technologies for the next decade

most successful high-end embedded computing module standard COM Express. The COM Express standard is predicted to keep its leading position until the end of this decade. Over the…

/it/congatec/comunicato-stampa/article/congatec-presents-embedded-computer-technologies-for-the-next-decade/ 22.10.2020

Comunicati stampa congatec presents first COM Express Type 7 modules with Intel® Xeon® D processors

Eder, Marketing Director at congatec and editor of the COM Express 3.0 specification that includes the new COM Express Type 7 Pinout, emphasizes the significance of the new COM …

/it/congatec/comunicato-stampa/article/congatec-presents-first-com-express-type-7-modules-with-intelr-xeonr-d-processors/ 15.10.2018

Comunicati stampa congatec presents its aReady.COM solutions at CIIF 2025

One of the key highlights is the high-performance aReady.COM ecosystem, including pre-installed, application-ready software building blocks significantly simplifying application …

/it/congatec/comunicato-stampa/article/congatec-presents-its-areadycom-solutions-at-ciif-2025/ 10.09.2025

Comunicati stampa congatec presents its conga-BA945, a new COM Express module with an Intel® Atom™ processor and high graphics performance

on the Intel® Atom™ processor family. The conga-BA945 is a COM Express module with type 2 pinout and conforms to the specified COM Express basic size of 95x125 mm². The Intel®…

/it/congatec/comunicato-stampa/article/congatec-presents-its-conga-ba945-a-new-com-express-module-with-an-intelr-atomtm-processor-and-high-graphics-performance/ 15.10.2018