Press Releases

Integration of JUMPtec modules creates the world’s most comprehensive portfolio of application-ready COM platforms

Wide range of congatec modules support for computationally powerful, energy-efficient embedded AI applications

KontronOS, the secure, hardened Linux®-based Operating System, expands congatec’s standards-based and cybersecure aReady.COM offering

La serie di moduli in formato COM-HPC Mini di congatec con processori Dragonwing™ IQ-X di Qualcomm apre la strada a nuove applicazioni

I moduli COM (Computer-on-Module) di congatec basati sui nuovi processori Dragonwind™ di Qualcomm accelerano la diffusione di applicazioni edge AI robuste ad alte prestazioni

congatec presents its expanded portfolio and aReady.COM platforms

Company drives attendance with free exhibit hall pass, $50 value

conga-TC675r completes IEC 60068 testing, offering a compact, application-ready embedded module for extreme environments

congatec and Aaronn Electronic join forces to deliver greater product diversity, faster development times, and personalized support in the DACH region

New VDC Research white paper with congatec and NXP: Standardized COMs with i.MX 95 processors drive industrial vision AI adoption amidst 48.3% edge AI growth

congatec to showcase application-ready embedded solution platforms at CIIF 2025 in Shanghai

congatec GmbH acquisisce la maggioranza di JUMPtec GmbH, rafforzando la leadership tecnologica e ampliando l'offerta nel settore dei moduli COM

New local manufacturing capacities strengthen congatec's global presence and address international trade disruptions

High-performance ecosystems for innovative solutions

Moduli COM resistenti al freddo estremo