Recherche

Pages Expert Videos

Video AMD Ryzen AI P100 Drives conga-TCRP1: Your Next-Gen COM Express Module In this video, Florian Drittenthaler, Product Line Manager at congatec, introduces the conga-TCRP1,…

/fr/support/videos/expert-videos/ 23.10.2026

Fichiers Datasheet conga-TC700

conga-TC700 Datasheet www.congatec.com conga-TC700 Form factor COM Express® Compact | Type 6 connector pinout CPUs Intel® Core™ Ultra Processors Meteor Lake-U [...] NPU…

PDF – 344 Ko 21.05.2025

Communiqués de presse Le leader des Computer-on-Modules investit dans le pionnier des COM

transparence la gamme de produits et l'inventaire des modules COM-HPC, COM Express, SMARC et Qseven de JUMPtec. Pour les clients de JUMPtec, les relations commerciales…

/fr/congatec/communiques-de-presse/article/le-leader-des-computer-on-modules-investit-dans-le-pionnier-des-com/ 12.01.2026

Fichiers User's Guide for conga-HPC/uATX-Server

components, features and connectors available on the congatec COM-HPC carrier board. It is one of the documents that should be referred to when designing a COM Express™…

PDF – 4 Mo 07.07.2025

Pages Computer-on-Modules with aReady.IOT

la polyvalence et la scalabilité, ces Computer-on-Modules (COMs) constituent la base idéale pour des applications IoT innovantes. COM-HPC COM Express SMARC / Qseven / Pico-ITX

/fr/aready/areadyiot-coms/ 23.10.2026

Fichiers Datasheet conga-HPC/mRLP

Datasheet conga-HPC/mRLP conga-HPC/mRLP www.congatec.com Form Factor COM-HPC Mini CPUs Intel® Core™ 13th Gen Processors Raptor Lake-P (U-Series, P-Series) DRAM Up to 32 GB [...] …

PDF – 356 Ko 06.08.2025

Fichiers Datasheet conga-TC675r

Datasheet conga-TC675r www.congatec.com conga-TC675r Form factor COM Express® Compact | Type 6 connector pinout CPUs Intel® Core™ 13th Gen Processors Raptor [...] 065810…

PDF – 291 Ko 07.08.2025

Fichiers

Description HEVA-LEK1v1_IO 065550 I/O shield standard size for COM-HPC server carrier board with 40 mm height for LEK1v1 HEVA-LEK1v2_IO 065551 I/O shield standard size for COM-HPC…

PDF – 1 Mo 12.08.2025

Communiqués de presse congatec presents its aReady.COM solutions at CIIF 2025

One of the key highlights is the high-performance aReady.COM ecosystem, including pre-installed, application-ready software building blocks significantly simplifying application …

/fr/congatec/communiques-de-presse/article/congatec-presents-its-areadycom-solutions-at-ciif-2025/ 10.09.2025

Communiqués de presse Combined expertise for embedded Computer-on-Module integration

easier access to a broader range of Computer-on-Modules (COMs), including application-ready software building blocks and full system integration services. As part of the…

/fr/congatec/communiques-de-presse/article/combined-expertise-for-embedded-computer-on-module-integration/ 23.09.2025