conga-BS77 (EOL)
COM Express™ Basic Type 2 모듈 3세대 Intel® Core™ 프로세서
- 최고성능 COM Express Basic Type 2 모듈
- 3세대Intel® Core™ 기반 플랫폼
- HD 그래픽, HD 화상 회의를 위한 원활한 트랜스 코드 지원
- 향상된 그래픽 성능, DirectX®11
Specification
Intel® Flexible Display Interface (FDI), Intel® Dynamic Video Memory Technology (Intel®DVMT) OpenGL 3.1 and DirectX11 support. Three independent pipelines provide support for three independent displays (must be 2 DisplayPort plus any other display).
It is capable of calculating efficient hashand RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e commerce will benefit also with improved authentication, integrity and confidence levels.
ACPI 3.0 compliant, Smart Battery Management
Operating: 0 to +60°CStorage: -20 to +80°C
Documents
Manual
Application Note
Data Sheet
Software
Use for BIOS update or customization and panel configuration.Linux source version.
Use for BIOS update or customization and panel configuration.Linux source version.
Use for BIOS update or customization and panel configuration.
Use for BIOS update or customization and panel configuration.
Use for BIOS update or customization and panel configuration.
Product Variants
Ecosystem Details
Cooling solutions
Standard active cooling solution for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height and integrated 12V fan. All stand-offs are with 2.7mm bore hole.
Standard active cooling solution for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height and integrated 12V fan. All stand-offs are M2.5mm threaded.
Standard passive cooling solution for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All stand-offs are with 2.7mm bore hole.
Standard passive cooling solution for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All stand-offs are M2.5mm threaded.
Standard heatspreader for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes. All stand-offs are with 2.7mm bore hole.
Standard heatspreader for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes. All stand-offs are M2.5mm threaded.
Memory
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 4GB RAM.
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 8GB RAM.
DDR3L SODIMM memory module with 1600MT/s (PC3L-12800S) and 2GB RAM.
Accessories
conga-CKIT (EOL)
이 제품은 모든 COM Express™ Type 2 모듈을 즉시 평가할 수 있는 개발 키트입니다.
conga-CEVAL
COM Express® Type 2 모듈을 지원하는 Evaluation Carrier 보드
conga-Cdebug
COM Express® Type 2 모듈과 Carrier 보드 디버깅 플랫폼
conga-FPA2 (EOL)
Universal Flat Panel 어댑터 보드
conga-LDVI
LVDS 출력을 위한 DVI 컨버터 모듈