COM-HPC Introduction
Scope?
Within this 3 hours training you will get an overview of the new PICMG formfactor COM-HPC. Both, server and client will be covered.
Target Audience?
System Architects, Principal Engineers, Product Managers
Agenda
- Why a new standard? The PICMG workgroup
- The COM-HPC connector
- Module types and sizes
- COM Express vs. COM-HPC
- Cooling concepts
- Signal integrity challenges
- congatec COM-HPC roadmap
- New COM-HPC interface technology
- congatec evaluation boards
- Q&A
More information about COM-HPC
COM-HPC carrier board designs
COM-HPC is the upcoming new standard for modular high-end edge servers. It provides significantly faster and almost twice as many interfaces as COM Express. As a result, carrier board design requirements are increasing exponentially. How can developers prepare for the new challenges?
COM HPC Server – the new Server-on-Module standard
What are the most important markets and applications for the new high-end Server-on-Modules and what are the limits?
COM-HPC: What developers and users need to know
The embedded computing industry is about to launch COM-HPC as the next-generation standard for modular system designs. Since COM-HPC is complex and sometimes
misunderstood, there is a need for clear information.
COM-HPC
COM-HPC™ is the new and coming PICMG standard for high-performance Computer-on-Modules. The pinout and therefore also the functionality were recently officially approved. Elektronik is revealing further- details.
