First COM-HPC and next-gen COM Express modules
11th Gen Intel® Core™ processors (Code name: Tiger Lake) with two great new design options on COM-HPC and COM Express
The first COM-HPC Client size A module and a next generation COM Express Compact Computer-on-Module provides engineers the choice to further scale the performance of their existing systems or develop the next generation of products utilizing COM-HPC’s broader array of interfaces. OEMs will benefit from the substantial performance improvements as well as communication enhancements that the new modules based on 11th Gen Intel® Core™ processors deliver to the high-end computing sector. Typical applications can be found in many high-end solutions, from embedded systems and edge computing nodes to network hubs, and local fog data centers to core network appliances, as well as ruggedized central cloud data centers for critical government applications.
The modules
conga-HPC/cTLU
- 11th Generation Intel® Core™
- Power- and size-optimized design
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 4
conga-TC570r
- 11th Generation Intel® Core™
- Extremely rugged with soldered memory
- Extended temperature range options
- IEC-60068 certified
- PCIe Gen 4
conga-TC570
- 11th Generation Intel® Core™
- Compact design
- Up to 4 cores
- Extended temperature range options
- PCIe Gen 4
Videos
conga-TC570 - high-performance COM Express based on 11th Gen Intel® Core™ processors
conga-TC570r - New ultra-rugged 11th Gen Intel® Core® congatec modules with soldered RAM
Learn more about our 11th Gen Intel Core based Computer-on-Modules
COM Express Type 6 y COM-HPC Client
Por primera vez en muchos años, los procesadores embebidos de alta gama están disponibles en dos opciones de factor de forma COM (Computer on Module), COM-HPC® Client y COM Express® Type 6. La llegada de la 11ª generación de procesadores Intel® Core® (nombre en código Tiger Lake) ofrece a los desarrolladores la oportunidad de decidir qué factor de forma se ajusta más a los requisitos de su proyecto.
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Incremento de rendimiento masivo para el Edge
Los nuevos procesadores Intel de las clases Xeon, Core y Celeron (con nombre en código Tiger Lake H) pueden desarrollar completamente su rendimiento en el estándar COM-HPC. Su disponibilidad en el catálogo del líder del mercado de módulos congatec anuncia una nueva era en el desarrollo de sistemas basados en módulos.
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11th Gen Intel Core Solution Brief
Built on 11th Gen Intel® Core™ processors, congatec’s conga-TS570 COM Express Type 6 and conga-HPC/cTLH COM-HPC Client modules bring near real- time performance, scalability, security, and resilience to a new class of edge computing applications.
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Módulos COM robustos
La mayoría de los módulos COM estándar utilizan conectores SO-DIMM para integrar la memoria principal. Dado que la memoria principal suele personalizarse para la aplicación específica, este enfoque modular funciona bien para los fabricantes de módulos y sus clientes OEM
