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conga-HPC/EVAL-Server
Evaluation Carrier Board for COM-HPC Server Type Modules
- Evaluation Carrier Board for COM HPC Server Type Modules
- Routing of the entire signals provided by COM HPC Module Base Specification R1.0 to standard interface connectors
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Specification
Formfactor
Extended ATX
Board Variant
Evaluation Carrier Board for COM-HPC Server Type Modules (Sizes D and E)
Internal Connectors and Features
- 2x PCIe x16 connector
- 2x PCIe x8 connector
- 3x PCIe x4 connector
- 2x dual USB 2.0 header
- M.2 Key M 2230 / 2242 / 2260 / 2280 / 22110 8x Ethernet KR interfaces connector
- 2x SATA
- SATA Power
- 2x UART DB9 from module
- 1x UART DB9 from BMC
- 1x UART DB9 for BMC console
- GP SPI header
- I2C header
- SMB header
- eSPI header
- SPI socket
- GPIO header
- Feature header
- 3x Fan
External Connectors
- 4x USB3.2 Gen 1 Type A
- DP through BMC
- 10GbE RJ45 through module
- GbE RJ45 through ASPEED AST2600
Postcode
4x 7-Segment Postcode LEDs connected to PD I2C
Power Input
- ATX connector, 12V/GND banana jacks
Operating Temperature
Operating Temp.: -40°C … +85°C | Storage Temp.: -40°C … +85°C
Humidity
Operating Hum.: 10% … 90% r. H. non cond. Storage Hum.: 5% … 95% r. H. non cond.
Size
304.8 x 330.2 mm (approx. 12 x 13 inches)
Documents
All documents found on this page are updated without notification. Always check this page for the latest version.
Data Sheet
21.02.2022
Schematics
09.03.2022
https://www.congatec.com/es/productos/login/formdownload/
