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conga-QMX8
Highest performance Qseven module based on NXP i.MX8 processor series
- NXP i.MX8 ARM Cortex-A72, Cortex-A53 and -M4F
- Advanced Graphics, Performance and Virtualization
- 3D Graphics up to 4K with HDMI 2.0a & LVDS
- Vision Extensions, MIPI CSI-2 dual camera interface
- Extended longevity, up to 15 years
- Temperature range up to -40°C - +85°C
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Specification
VPU (4K h.265 dec / HD h.264 enc) | 2D Graphics (GPU2D) and 3D Graphics (GPU3D) | 3D graphics with 4 shaders up to 200MT/s 2 independent displays | dual stream 1080p/720p decoder/encoder | OpenGL 3.1 | Vulcan | VX extensions | OpenCL 2.0
Commercial : Operating: 0 to +60°C Storage: -20 to +70°C Industrial: Operating: -40 to +85°C Storage: -40 to +85°C
Documents
Data Sheet
Part Number
Qseven module with high-performance NXP i.MX8 Quad Max processor with 2x ARM® Cortex®-A72, 4x ARM® Cortex®-A53 and 2x ARM® Cortex®-M4F, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Lidded package. Commercial temperature range.
Qseven module with high-performance NXP i.MX8 Quad Plus processor with 1x ARM® Cortex®-A72, 4x ARM® Cortex®-A53 and 2x ARM® Cortex®-M4F, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Lidded package. Commercial temperature range.
Qseven module with high-performance NXP i.MX8 Quad Plus processor with 2x ARM® Cortex®-A72 and 2x ARM® Cortex®-M4F, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Lidded package.
Commercial temperature range.
Qseven module with high-performance NXP i.MX8 Quad Max processor with 2x ARM® Cortex®-A72, 4x ARM® Cortex®-A53 and 2x ARM® Cortex®-M4F, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Lidded package. Industrial temperature range.
Qseven module with high-performance NXP i.MX8 Quad Plus processor with 1x ARM® Cortex®-A72, 4x ARM® Cortex®-A53 and 2x ARM® Cortex®-M4F, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Lidded package. Industrial temperature range.
Qseven module with high-performance NXP i.MX8 Dual Max processor with 2x ARM® Cortex®-A72 and 2x ARM® Cortex®-M4F, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Lidded package. Industrial temperature range.
Passive cooling solution for Qseven module conga-QMX8 with lidded NXP i.MX8 ARM Cortex® A72 processor. All standoffs are M2.5mm thread.
Passive cooling solution for Qseven module conga-QMX8 with lidded NXP i.MX8 ARM Cortex® A72 processor. All standoffs are with 2.7mm bore hole.
Standard heatspreader for Qseven module conga-QMX8 with lidded NXP i.MX8 ARM Cortex® A72 processor. All standoffs are M2.5mm thread.
Standard heatspreader for Qseven module conga-QMX8 with lidded NXP i.MX8 ARM Cortex® A72 processor. All standoffs are with 2.7mm bore hole.
P/N 016402
Qseven module with high-performance NXP i.MX8 Quad Plus processor with 2x ARM® Cortex®-A72 and 2x ARM® Cortex®-M4F, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Lidded package.
Commercial temperature range.
P/N 016400
Qseven module with high-performance NXP i.MX8 Quad Max processor with 2x ARM® Cortex®-A72, 4x ARM® Cortex®-A53 and 2x ARM® Cortex®-M4F, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Lidded package. Commercial temperature range.
P/N 016401
Qseven module with high-performance NXP i.MX8 Quad Plus processor with 1x ARM® Cortex®-A72, 4x ARM® Cortex®-A53 and 2x ARM® Cortex®-M4F, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Lidded package. Commercial temperature range.
P/N 016423
Qseven module with high-performance NXP i.MX8 Dual Max processor with 2x ARM® Cortex®-A72 and 2x ARM® Cortex®-M4F, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Lidded package. Industrial temperature range.
P/N 016421
Qseven module with high-performance NXP i.MX8 Quad Max processor with 2x ARM® Cortex®-A72, 4x ARM® Cortex®-A53 and 2x ARM® Cortex®-M4F, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Lidded package. Industrial temperature range.
P/N 016422
Qseven module with high-performance NXP i.MX8 Quad Plus processor with 1x ARM® Cortex®-A72, 4x ARM® Cortex®-A53 and 2x ARM® Cortex®-M4F, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Lidded package. Industrial temperature range.