Congatec AG
conga-TS370

conga-TS370

  • 8th Generation Intel® Core™ processor with up to 6 Cores
  • Intel® Xeon® processors for data center applications
  • Support for USB 3.1 Gen2 with 10Gb/s
  • Intel® Optane™ memory support
  • ECC memory support
  • Up to 32 GByte dual channel DDR4 memory

Specification

Formfactor COM Express Basic
CPU Intel® Core™ i7-8850H (6 x 2.6 / 4.3 GHz, 9MB cache, 45W)
Intel® Core™ i5-8400H (4 x 2.5 / 4.2 GHz, 8MB cache, 45W)
Intel® Xeon® E-2176M (6 x 2.7 / 4.4 GHz, 12MB cache, 45W)
DRAM 2 Sockets, SO-DIMM DDR4 up to 2666 MT/s and 32GByte dual channel, optionally with ECC support (Intel® Xeon®)
Chipset Mobile Intel® PCH-H QM370 Series or CM246 Series for Intel Xeon Processor
Ethernet Intel® i219-LM GbE LAN Controller with AMT 12.0 support
I/O Interfaces 8 x PCI Express GEN 3.0 lanes
4 x Serial ATA Gen 3
4 x USB 3.1 Gen 2 @ 10 GB/s
8 x USB 2.0
1 x PEG x16 Gen 3
LPC bus
I²C bus (fast mode, 400 kHz, multi-master)
2 x UART
Sound Digital High Definition Audio Interface with support for multiple audio codecs
Graphics Intel® Gen9 UHD Graphics Engine with OpenCL 2.0, OpenGL 4.3 / 4.4 and DirectX 11/12 (for Windows 10) support
up to three independent displays: HDMI 1.4a / DisplayPort 1.2 / eDP 1.4 | High performance hardware MPEG-2 decoding | WMV9 (VC-1) and H.265 (HEVC) support Blu-ray support@ 40 MBit/s | HEVC, VP9 and VDENC encoding
congatec Board Controller Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | LVDS backlight control I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control
embedded BIOS Features AMI AptioV® UEFI 2.x firmware
8/16 MByte serial SPI firmware flash
Security The conga-TS370 is equipped with a discrete ”Trusted Platform Module” (TPM 2.0)
Power Management ACPI 4.0 with battery support
Operating Systems Microsoft® Windows 10 (64bit only)
Microsoft® Windows 10 IoT Enterprise (64bit only)
Linux
Power Consumption See User's Guide for full details
Temperature Commercial: Operating: 0 .. +60°C | Storage: -40 .. +85°C
Humidity Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.
Video Interfaces 3x TMDS (HDMI) / DisplayPort 1.2 with support for Multi-Stream Transport (MST) | resolutions up to 4k | VGA (optional)
Dual channel LVDS transmitter, Supports flat panels 2x24 Bit interface | VESA and openLDI colour mappings | resolutions up to 1920x1200 Automatic Panel Detection via EDID/EPI
Size 95 x 125 mm (3.74" x 4.92")

Documents

Data Sheet

Manual

Part Number

P/N Title Description
049000 conga-TS370/i7-8850H COM Express Type 6 Basic module with Coffeelake-H Intel® Core™ i7-8850H hexa core processor with 2.6GHz, 9MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface. Chipset QM370. TPM 2.0.
049001 conga-TS370/i5-8400H
COM Express Type 6 Basic module with Coffeelake-H Intel® Core™ i5-8400H quad core processor with 2.5GHz, 8MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface. Chipset QM370. TPM 2.0.
049002 conga-TS370/E-2176M
COM Express Type 6 Basic module with Coffeelake-H Intel® Xeon® Processor E-2176M, hexa core processor with 2.7GHz, 12MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface with ECC support. Chipset CM246. TPM 2.0.
068790 DDR4-SODIMM-2400 (4GB) DDR4 SODIMM memory module with 2400 MT/s and 4GB RAM
068791 DDR4-SODIMM-2400 (8GB) DDR4 SODIMM memory module with 2400 MT/s and 8GB RAM
068792 DDR4-SODIMM-2400 (16GB) DDR4 SODIMM memory module with 2400 MT/s and 16GB RAM
068795 DDR4-SODIMM-2400 ECC (4GB) 4 GByte ECC DDR4 SODIMM memory module | 2400 MT/s (PC4-2400) | 260 pin | supply voltage 1,2V
068796 DDR4-SODIMM-2400 ECC (8GB) 8 GByte ECC DDR4 SODIMM memory module | 2400 MT/s (PC4-2400) | 260 pin | supply voltage 1,2V
068797 DDR4-SODIMM-2400 ECC (16GB) 16 GByte ECC DDR4 SODIMM memory module | 2400 MT/s (PC4-2400) | 260 pin | supply voltage 1,2V

Accessories

conga-IT6

conga-IT6

COM Express Type 6 Carrier Board on Mini-ITX form factor
conga-TEVAL

conga-TEVAL

Evaluation Carrier Board for COM Express® Type 6 Modules