congatec at the IoT/M2M Spring

From April 10th to 12th, congatec will attend the IoT/M2M spring, the biggest IT show in Japan. It is expected to gather a total of 40,000 embedded system engineers and professionals seeking for IoT technology, as well as 620 exhibitors for presenting the latest embedded technology. You are invited to meet congatec at booth 10-42, West Hall 2, 1F, at Tokyo Big Sight.

congatec will be showing a complete line of embedded computer modules, single board computers(SBCs) , embedded design services and IoT platform.

 

Product highlights

  • Boards and COMs based on the latest 8th Generation Intel® Core™ Mobile processors (codenamed Whiskey Lake)
  • First 3.5” Juke Single Board Computer (SBC)
  • First COM Express Type7 module based on AMD EPYCTM 3000 series
  • AI based Embedded vision platform for retail market
  • SMARC and Qseven modules based on the latest NXP i.MX8 processor series
  • Real-Time Hypervisor - Hardware Consolidation / Real-time virtualization
  • First SMARC 2.0 Quick Starter Kit for NXP i.MX8 designs

 

 

conga-B7E3


COM Express Basic Type 7 Server Class module based on AMD EPYC™ 3000 processor series

conga-JC370


Highest Performance 3.5'' Single Board Computer based on 8th Generation Intel® Core™ processor series called "Whiskey Lake"

conga-TC370


COM Express Type 6 Compact module based on 8th Generation Intel® Core™ processor family

conga-IC370


Highest Performance Thin-Mini-ITX board based on 8th Generation Intel® Core™ Mobile Processors "Whiskey Lake"