COM-HPC Introduction



Within this 3 hours training you will get an overview of the new PICMG formfactor COM-HPC. Both, server and client will be covered.

Target Audience?

System Architects, Principal Engineers, Product Managers


  • Why a new standard? The PICMG workgroup
  • The COM-HPC connector
  • Module types and sizes
  • COM Express vs. COM-HPC
  • Cooling concepts
  • Signal integrity challenges
  • congatec COM-HPC roadmap
  • New COM-HPC interface technology
  • congatec evaluation boards
  • Q&A



More information about COM-HPC

COM-HPC carrier board designs

COM-HPC is the upcoming new standard for modular high-end edge servers. It provides significantly faster and almost twice as many interfaces as COM Express. As a result, carrier board design requirements are increasing exponentially. How can developers prepare for the new challenges?

Download Whitepaper 

COM HPC Server – the new Server-on-Module standard

What are the most important markets and applications for the new high-end Server-on-Modules and what are the limits?


Download Whitepaper

COM-HPC: What developers and users need to know

The embedded computing industry is about to launch COM-HPC as the next-generation standard for modular system designs. Since COM-HPC is complex and sometimes
misunderstood, there is a need for clear information.

Download Whitepaper


COM-HPC™ is the new and coming PICMG standard for high-performance Computer-on-Modules. The pinout and therefore also the functionality were recently officially approved. Elektronik is revealing further- details.

Download Whitepaper