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conga-bEP7

COM Express® Basic Type 7 with AMD EPYC™ Embedded 3000 SoC Processors

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    Cooling Solutions

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        Zusätzliche Ecosystem Parts


        Cooling Solutions

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        conga-bEP7

        formerly JUMPtec COMe-bEP7
        COM Express® Basic Type 7 with AMD EPYC™ Embedded 3000 SoC Processors

        Learn all about COMs - download the guide

        • COM Express module COMe-bEP7 with AMD EPYC™ 3000 series, headless and server-grade.
        • Scalable high performance up to 16 CPU cores.
        • Supports up to 4 × SODIMM sockets, max. 128 GB memory.
        • Four 10 Gb Ethernet ports; available for commercial or extended temperature ranges.
        Congatec Logo
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        Zusätzliche Ecosystem Parts

        Cooling Solutions

        Carrierboards

        Spezifikation

        Formfactor
        COM Express Basic
        CPU
        AMD EPYC™ Embedded 3000 Model 3451 (16 x 2.1 GHz, 32MB L3 cache, 100W)
        AMD EPYC™ Embedded 3000 Model 3351 (12 x 1.90 GHz, 32MB L3 cache, 80W)
        AMD EPYC™ Embedded 3000 Model 3251 (8 x 2.5 GHz, 16MB L3 cache, 55W)
        AMD EPYC™ Embedded 3000 Model 3255 (8 x 2.5 GHz, 16MB L3 cache, 55W)
        DRAM
        2x DDR4 SODIMM for up to 64 GByte non-ECC/ECC memory
        Ethernet
        Internet i210
        I/O Interfaces
        SM-Bus
        RTC
        LPC
        SPI Flash
        2 x serial interface (RX/TX only)
        24 x PCIe Gen3
        4 x USB 3.1 Gen1
        4 x USB 2.0
        Mass storage
        2xSATA 6Gb/s
        embedded BIOS Features
        AMI UEFI
        Security
        TPM
        Power Management
        OS ACPI PM support for Critical Shutdown
        Operating Systems
        Ubuntu Linux
        Microsoft® Windows Server 2016
        Temperature
        Commercial Grade Version: 0 °C to 60 °C
        Industrial Grade Version: -40 °C to 85 °C
        Humidity
        93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78)
        Features
        Staged Watchdog
        optional JTAG debug interface
        Size
        95 x 125 mm (3.74" x 4.92")

        Dokumente

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        Data Sheet

        Data Sheet for conga-bEP7
        15.12.2025

        Whitepaper

        The Computer-on-Modules Compendium Download for free and gain the ultimate reference guide to COM technology. From fundamentals to advanced use cases – this compendium helps you design faster, smarter, and more efficiently.

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              conga-bEP7/E3251 (P/N 68010-0000-51-2)

              COM Express® Basic Type 7 with AMD EPYC™ Embedded 3000 SoC Processors

              conga-bEP7/E2 E3255 (P/N 68011-0000-55-2)

              COM Express® Basic Type 7 with AMD EPYC™ Embedded 3000 SoC Processors

              conga-bEP7/E3351 (P/N 68010-0000-51-3)

              COM Express® Basic Type 7 with AMD EPYC™ Embedded 3000 SoC Processors

              conga-bEP7/E3451 (P/N 68010-0000-51-4)

              COM Express® Basic Type 7 with AMD EPYC™ Embedded 3000 SoC Processors

              conga-bEP7/3351 with 4 SODIMM sockets (P/N 68010-0000-61-3)

              COM Express® Basic Type 7 with AMD EPYC™ Embedded 3000 SoC Processors

              conga-bEP7/E3451 with 4 SODIMM sockets (P/N 68010-0000-61-4)

              COM Express® Basic Type 7 with AMD EPYC™ Embedded 3000 SoC Processors

              Ecosystem Details

              Cooling Solutions

              HSP COMe-bEP7 THROUGH (P/N 68010-0000-99-1)
              HSP COMe-bEP7 THREADED (P/N 68010-0000-99-0)

              Carrierboards

              COM Express® Eval Carrier Type 7 (P/N 68300-0000-00-0)
              COM Express® Eval Carrier2 T7 (P/N 68301-0001-00-8)

              COMe Eval Carrier T7 G2-8, 8 mm stack height, COM.0 R3.1, support of PCIe Gen4

              COM Express® Eval Carrier2 T7 (P/N 68301-0000-00-8)

              COMe Eval Carrier T7 G2-8, 8 mm stack height, COM.0 R3.0, support of PCIe Gen3

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