conga-BP77 (EOL)
COM Express™ Basic Typ 2 Modul basierend auf der dritten Generation Intel® Core™ Prozessorfamilie
- Hochleistungs COM Express Typ 2 Modul
- dritte Generation Intel® Core™ Prozessorplattform
- Besserer transcode HD-HD, HD Video Conferencing
- Verbesserte Grafikleistung, DirectX®11
Spezifikation
Intel® Flexible Display Interface (FDI), Intel® Dynamic Video Memory Technology (Intel®DVMT) OpenGL 3.1 and DirectX11 support. Three independent pipelines provide support for three independent displays (must be 2 DisplayPort plus any other display).
It is capable of calculating efficient hashand RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e commerce will benefit also with improved authentication, integrity and confidence levels.
ACPI 3.0 compliant, Smart Battery Management
Operating: 0 to +60°CStorage: -20 to +80°C
Dokumente
Image
Application Note
Data Sheet
Software
Use for BIOS update or customization and panel configuration.Linux source version.
Use for BIOS update or customization and panel configuration.Linux source version.
Use for BIOS update or customization and panel configuration.
Use for BIOS update or customization and panel configuration.
Use for BIOS update or customization and panel configuration.
Produktvarianten
Ecosystem Details
Cooling solutions
Standard active cooling solution for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height and integrated 12V fan. All stand-offs are with 2.7mm bore hole.
Standard active cooling solution for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height and integrated 12V fan. All stand-offs are M2.5mm threaded.
Standard passive cooling solution for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All stand-offs are with 2.7mm bore hole.
Standard passive cooling solution for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All stand-offs are M2.5mm threaded.
Standard heatspreader for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes. All stand-offs are with 2.7mm bore hole.
Standard heatspreader for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes. All stand-offs are M2.5mm threaded.
Memory
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 4GB RAM.
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 8GB RAM.
DDR3L SODIMM memory module with 1600MT/s (PC3L-12800S) and 2GB RAM.
Zubehör
conga-CKIT (EOL)
This complete kit provides the ability to start evaluating COM Express™ Type 2 modules immediately.
conga-CEVAL
Evaluation Carrier Board for COM Express® modules based on Type 2 pinout definition
conga-Cdebug
COM Express® Debug Platform for Type 2 Modules and Carrier Boards
conga-FPA2 (EOL)
Universal Flat Panel Adapter Board
conga-LDVI
DVI Converter Module for LVDS