COM-HPC Introduction
Scope?
Within this 3 hours training you will get an overview of the new PICMG formfactor COM-HPC. Both, server and client will be covered.
Target Audience?
System Architects, Principal Engineers, Product Managers
Agenda
- Why a new standard? The PICMG workgroup
- The COM-HPC connector
- Module types and sizes
- COM Express vs. COM-HPC
- Cooling concepts
- Signal integrity challenges
- congatec COM-HPC roadmap
- New COM-HPC interface technology
- congatec evaluation boards
- Q&A
More information about COM-HPC
COM-HPC载板设计
近期推出的COM-HPC新标准是面向模块化高端边缘服务器。该标准的速度相比 COM Express显著提升且接口增加近双倍，因此，对载板设计的要求也急剧提升。开发者们该作何准备以应对全新挑战？
COM HPC Server – the new Server-on-Module standard
What are the most important markets and applications for the new high-end Server-on-Modules and what are the limits?
COM-HPC: 开发者和用户需要了解的信息
COM-HPC: 开发者和用户需要了解的信息 - 嵌入式计算行业计划推出COM-HPC作为模块化系统设计的下一代标准。由于 COM-HPC 设计复杂，且有时会被错误理解，因此需要有明确表述的信息。
