conga-CCA

COM Express™ Compact Type 2模块

  • 第二代英特尔®凌动™双核处理器, 3.5瓦功耗
  • 絕佳图形性能
  • 配备嵌入式固件解决方案及UEFI BIOS

Specification

Formfactor
COM Express Compact
DRAM
max. 4 GByte DDR3 1066 MHz
Ethernet
Realtek RTL8111E GbE
I/O Interfaces
4 x PCI Express™
2 x SATA
8 x USB 2.0
1 x PCI bus Rev. 2.3
1 x LPC bus
1 x I²C bus
2 x Express Card®
1 x EIDE (UDMA-66/100)
congatec Board Controller
Multi Stage Watchdog, non-volatile User Data Storage, Manufacturing and Board information, Board Statistics, BIOS Setup, Data Backup, I²C bus (fast mode, 400 kHz, multi-master), Power Loss Control
embedded BIOS Features
AMI Aptio UEFI
4 MByte serial SPI firmware flash
Security
This congatec COM Express Compact board can be optionally equipped with a discrete ”Trusted Platform Module” (TPM).
It is capable of calculating efficient hash and RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e commerce will benefit also with improved authentication, integrity and confidence levels.
Power Management
ACPI 3.0
ACPI 3.0 compliant, Smart Battery Management
Operating Systems
Microsoft® Windows® 7
Microsoft® Windows® XP
Microsoft® Windows® embedded Standard
Linux
Windows Embedded Compact 7
Temperature
Standard
Operating: 0 to +60°CStorage: -20 to +80°C
Humidity
Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.
Video Interfaces
1 x DisplayPort
1 x HDMI
LVDS 2x24
Size
95 x 95 mm (3,74" x 3,74")

Documents

Accessories

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conga-FPA2

通用平板配置器

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基於Type2引脚定义的COM Express 评估载板

Part Number

047030
conga-TCA/CSP-T-LF

Standard passive cooling solution for COM Express modules conga-TCA and CCA with 3mm fins. All standoffs are M2.5mm thread.

047031
conga-TCA/CSP-B-LF

Standard passive cooling solution for COM Express modules conga-TCA and CCA with 3mm fins. All standoffs are with 2.7mm bore hole.

047032
conga-TCA/HSP-T

Standard heatspreader for COM Express modules conga-TCA and CCA. All standoffs are M2.5 thread.

047033
conga-TCA/HSP-B

Standard heatspreader for COM Express modules conga-TCA and CCA. All standoffs are 2.7mm bore hole.

047034
conga-TCA/CSP-T-HF

Standard passive cooling solution for COM Express module conga-TCA and CCA with 10mm fins. All standoffs are M2.5mm thread.

047035
conga-TCA/CSP-B-HF

Standard passive cooling solution for COM Express module conga-TCA and CCA with 10mm fins. All standoffs are 2.7mm bore hole.

047101
conga-CCA/N2600
COM Express Type 2 Compact module with Intel® Atom™ N2600 Dual Core processor with 1.6GHz, 1MB L2 cache and 1066MT/s DDR3 memory interface.
047102
conga-CCA/N2800
COM Express Type 2 Compact module with Intel® Atom™ N2800 Dual Core processor with 1.86GHz, 1MB L2 cache and 1066MT/s DDR3 memory interface.
047103
conga-CCA/D2550
COM Express Type 2 Compact module with Intel® Atom™ D2550 Dual Core processor with 1.86GHz, 1MB L2 cache and 1066MT/s DDR3 memory interface.
068750
DDR3-SODIMM-1066 (1GB)
DDR3 SODIMM memory module with 1066MT/s and 1GB RAM.
068760
DDR3-SODIMM-1066 (2GB)
DDR3 SODIMM memory module with 1066MT/s and 2GB RAM.
068765
DDR3-SODIMM-1066 (4GB)
DDR3 SODIMM memory module with 1066MT/s and 4GB RAM.
DDR3-SODIMM-1066 (1GB)
P/N 068750
DDR3 SODIMM memory module with 1066MT/s and 1GB RAM.
DDR3-SODIMM-1066 (2GB)
P/N 068760
DDR3 SODIMM memory module with 1066MT/s and 2GB RAM.
DDR3-SODIMM-1066 (4GB)
P/N 068765
DDR3 SODIMM memory module with 1066MT/s and 4GB RAM.
conga-CCA/D2550
P/N 047103
COM Express Type 2 Compact module with Intel® Atom™ D2550 Dual Core processor with 1.86GHz, 1MB L2 cache and 1066MT/s DDR3 memory interface.
conga-CCA/N2600
P/N 047101
COM Express Type 2 Compact module with Intel® Atom™ N2600 Dual Core processor with 1.6GHz, 1MB L2 cache and 1066MT/s DDR3 memory interface.
conga-CCA/N2800
P/N 047102
COM Express Type 2 Compact module with Intel® Atom™ N2800 Dual Core processor with 1.86GHz, 1MB L2 cache and 1066MT/s DDR3 memory interface.

技术

技术领导厂商德国康佳特自2005年即参与产业标准制定

 

支持

在全球主要地区提供标准和定制化产品工程支持

定制化

康佳特技术服务-定制化设计服务

 

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