Congatec AG
We simplify the use of embedded technology

Qseven - the Mobile COM Definition

Concept

Ultra-compact, legacy-free multi-platform-standard for mobile and ultra-mobile applications with unique thermal interface optimized for fanless cooling.

Benefits:

  • Low Cost
  • Small form factor 
  • Low height and edge connectors enable flat housing solutions
  • Low Power Consumption
  • Designed for fanless cooling
  • Legacy Free
  • Multi-Platform capable
  • Fast serial interfaces

Size:

70 x 70 mm² 

Power:

5 Volt DC, max. Power Consumption 12 Watt 

 

Connector:  

The used MXM edge connector is a robust, single-connector solution that is capable of handling high speed PCI Express signals. This connector is available in  different heights (5.5mm and 7.8mm) for maximum flexibility.

SMT Type 0.50mm [.020”] Pitch, 230 Pos (MXM Socket)

Consortium:

The Specification will be hosted by the  "Standardization Group for Embedded Technologies" SGET: www.sget.org

Latest Specification:

Rev. 2.1

Qseven Design Guide:

Rev. 2.0

Typical Applications: 

  • POS/Kiosk
  • Medical
  • Test&Measurement
  • Transportation
  • Building Technology
  • Entertainment

Reference Carrier Boards

Qseven Mini Carrier Board

Qseven Evaluation Reference Carrier Board