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21.04.2009

Foxconn Technology Group joins Qseven Consortium

The world’s best end-to-end manufacturing services provider has joined the Qseven standard thereby ensuring the long-term availability of MXM connectors
15.04.2009

PICMG Consortium Releases New COM Express Design Guide

Version 1.0 of the design specification has been completed under the auspices of congatec AG
31.03.2009

congatec AG Expands its Design Activities in Czech Republic

Deggendorf, Germany, March 31, 2009   * * *   congatec AG, a leading supplier of embedded computer modules headquartered in Deggendorf, Germany, announces that the company will be further extending its design activities in the...
03.03.2009

congatec Introduces First Full Industrial Grade Module Based on Intel® Atom™ Processor Z5xx Series

The new compact COM Express™ compatible module is specified for the full industrial temperature range.
03.03.2009

congatec presents Qseven starter kit for mobile, embedded applications

Nuremberg, Embedded World, March 3rd, 2009   * * *   congatec AG presents the Qseven Mobility Starter Kit. A complete rapid prototyping package for battery-powered, embedded systems. The compact size and low power consumption of...
13.02.2009

congatec presents the conga-ARkit, a reference platform for automation

The starter kit consists of both hardware and software as a design basis for PLC manufacturers
12.02.2009

congatec AG announces record results for 2008

Embedded specialist is confident for the future, despite economic crisis
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