From May 10th to 12th, congatec will be at ESEC spring, the biggest IT show in Japan. It attracts over 1,495 exhibitors and 89,285 visitors for showcasing the latest embedded technology. You are invited to meet congatec at booth W4-20, West Hall, 1F, at Tokyo Big Sight.
congatec will be showing a complete line of embedded computer modules, single board computers (SBCs) and embedded design and manufacturing services.
For detailed information please download our ESEC 2017 Flyer
- Boards and modules based on the latest Intel processor (Kaby lake)
- Industrial Ready-To-Use platform
- Power saving embedded modules
- Fast, energy efficient and high performance modules
- Brand new SMARC 2.0 platform with USB Type-C
- COM Express 3.0 Type 7 –Real Time Hypervisor
Highest Performance Thin-Mini-ITX board based on 7th Generation Intel® Core™ Mobile SOC U-Processors