congatec AG is launching the conga-CS45, a new high-performance COM Express compact module, at this year's SPS/IPC/Drives show. The module features the Intel® GS45 small form factor (SFF) chipset, which enables significant performance increases despite a smaller footprint and lower power consumption. The module is particularly suitable for mobile applications which require high graphics performance such as portable ultrasound devices. The module offers true high-end graphics performance which was unprecedented at such small dimensions until now. Even hardware implemented decompression for HDTV videos is already integrated in the chipset. In addition, the module offers a large choice of graphics interfaces ranging from SDVO, DVI and HDMI to DisplayPort.
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