Intel® Atom™ E680T processor with 1.6GHz, 512kB L2 cache. Industrial grade temperature range from -40°C to 85°C

Intel® Atom™ E640T processor with 1.0GHz, 512kB L2 cache. Industrial grade temperature range from -40°C to 85°C

Intel® Atom™ E680 processor with 1.6GHz, 512kB L2 cache

Intel® Atom™ E640 processor with 1.0GHz, 512kB L2 cache

Intel® Atom™ E640 processor 1.0GHz, 512kByteL2 cache and 2GByte DDR2 onboard memory. Based on Intel® Platform Controller Hub EG20

Intel® Atom™ E640T processor 1.0GHz, 512kByteL2 cache and 1GByte DDR2 onboard memory

Heatspreader for Qseven-Module conga-QA with 2.5mm threaded standoffs.

Intel Atom Z510 and Intel System controller Hub US15W CPU with 1.1GHz, 512kB L2-Cache, 400MHz FSB. 1.0GB DDR2 memory, onboard 2.0GB commercial SSD (MLC) and SATA.

Intel Atom Z510 and Intel System controller Hub US15W CPU with 1.1GHz, 512kB L2-Cache, 400MHz FSB. 1.0GB DDR2 memory and SATA. No SSD-Flash onboard.

Intel Atom Z530 and Intel System controller Hub US15W CPU with 1.6GHz, 512kB L2-Cache, 533MHz FSB. 1.0GB DDR2 memory and onboard 2.0 GB commercial (MLC) SSD. No SATA.

Intel Atom Z530 and Intel System controller Hub US15W CPU with 1.6GHz, 512kB L2-Cache, 533MHz FSB. 1.0GB DDR2 memory, onboard 4.0GB commercial SSD (MLC) and SATA.

Heatspreader for Qseven-Module conga-QA with 2.5mm threaded standoffs.

Evaluation platform for Qseven

Complete ready-to-use starter-kit for mobile applications

Cable Kit for Qseven mini carrier board. Consisting of: 4x USB adapter cable, 1x LVDS display cable, 1x Feature connector cable, 1x HDMI to DVI adapter cable.

SMART Battery Manager Module Design Kit. Including licence agreement for custumer integration, Hardware design files (Schematics, Bill of Material), Battery Manager Firmware (incl. commented source code), AVR-Programming Tool AT90 JTAG ICE MKII

LVDS to DVI converter board for digital flat panels with onboard EEPROM

COM Express Type 6 Basic module with Intel® Core™ i7-2710QE Quad Core processor 2.1GHz, 6MByte L2 cache and 1600MT/s dual channel DDR3 memory interface

COM Express Type 6 Basic module with Intel® Core™ i3-2330E dual core processor 2.2GHz, 3MByte L2 cache and 1333MT/s dual channel DDR3 memory interface

Standard heatspreader for high performance COM Express Type 6 modules conga-TM67 and conga-TM77 with integrated heat pipes. All stand-offs are with 2.7mm bore hole

Standard passive cooling solution for high performance COM Express Type 6 modules conga-TM67 and conga-TM77 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All stand-offs are with 2.7mm bore hole

Standard active cooling solution for high performance COM Express Type 6 modules conga-TM67 and conga-TM77 with integrated heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All stand-offs are with 2.7mm bore hole

DDR3-SODIMM memory module 1GByte RAM (1066 MT/s)

Intel® Celeron™ 807UE single core processor with 1.0GHz, 1MB L3 cache, 1333MT/s single channel DDR3 memory interface and no PEG Port.

Intel® Celeron™ 847E dual core processor with 1.1GHz, 2MB L2 cache and 1333MT/s dual channel DDR3 memory interface.

Intel® Core™ i7-2655LE dual core processor with 2.2GHz, 4MB L2 cache and 1333MT/s dual channel DDR3 memory interface.

Standard active cooling solution for high performance COM Express module conga-TS67 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height and integrated 12V fan. All stand-offs are with 2.7mm bore hole.

Standard passive cooling solution for high performance COM Express module conga-TS67 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All stand-offs are with 2.7mm bore hole.

Standard heatspreader for high performance COM Express module conga-TS67 with integrated heat pipes. All stand-offs are with 2.7mm bore hole.

DDR3-SODIMM memory module 1GByte RAM (1066 MT/s)

Intel® Core™ i7-2710QE Quad Core Processor with 2.1GHz, 6MB L2 cache and 1600MT/s dual channel DDR3 memory interface.

COM Express Basic module with Intel® Core™ i3-2330E dual core processor 2.2GHz, 3MByte L2 cache and 1333MT/s dual channel DDR3 memory interface

Standard passive cooling solution for high performance COM Express module conga-BM57 and conga-BM67 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All stand-offs are with 2.7mm bore hole

Standard active cooling solution for high performance COM Express module conga-BM57 and conga-BM67 with integrated heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All stand-offs are with 2.7mm bore hole

Standard heatspreader for high performance COM Express module conga-BM57 with integrated heat pipes. All stand-offs are with 2.7mm bore hole

DDR3-SODIMM memory module with 1 GB RAM (1066 MT/s)

COM Express Basic module with Intel® Core™ i7-2655LE dual core processor 2.2GHz, 4MByte L2 cache and 1600MT/s dual channel DDR3 memory interface

COM Express Basic module with Intel® Core™ i3-2340UE dual core processor 1.3GHz, 3MByte L2 cache and 1333MT/s dual channel DDR3 memory interface

COM Express Basic module with Intel® Celeron™ 827E single core processor 1.4GHz, 1.5MByte L3 cache and 1333MT/s dual channel DDR3 memory interface

Standard heatspreader for high performance COM Express module conga-BS57 with integrated heat pipes. All stand-offs are M2.5mm threaded

Standard passive cooling solution for high performance Standard passive cooling solution for high performance COM Express modules conga-BS57 and conga-BS67 with integrated heat pipes, 15mm fins and 20mm overall heat sink height

Standard active cooling solution for high performance COM Express modules conga-BS57 and conga-BS67 with integrated heat pipes, 15mm fins and 20mm overall heat sink height and integrated 12V fan. All stand-offs are M2.5mm threaded

DDR3-SODIMM memory module with 1 GB RAM (1066 MT/s)

Intel® Core™ i5-520M Processor with 2.4GHz (Max Turbo Frequency 2.933 GHz), 3MB L2 cache, 1066MT/s dual channel DDR3 memory interface.

DDR3-SODIMM memory module with 1 GB RAM (1066 MT/s)

DDR3-SODIMM memory module with 4 GB RAM (1066 MT/s)

Standard passive cooling solution for high performance COM Express module conga-BM57 and conga-BM67 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All stand-offs are with 2.7mm bore hole

Standard active cooling solution for high performance COM Express module conga-BM57 and conga-BM67 with integrated heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All stand-offs are with 2.7mm bore hole

Standard heatspreader for high performance for high performance COM Express module conga- BM57 with integrated heat pipes. All stand-offs are with 2.7 mm bore hole.

Intel® Core™ i7-610E processor with 2.53GHz, 4MB L2 cache and 1066MT/s dual channel DDR3 SODIMM ECC memory interface for up to 8GB.

Intel® Celeron® Dual Core Processor U3405 with 1.06GHz (BGA), 2MB L2 cache and 800MT/s dual channel DDR3 SODIMM ECC memory interface for up to 8GB.

DDR3-SODIMM memory module with 2 GB RAM (1066 MT/s)

Intel® Core™ I7-620LE Processor with 2.0 GHz (BGA) (Max. Turbo Frequency 2.8GHz), 4MB L2 cache, 1066MT/s dual channel DDR3 SODIMM memory interface for up to 8GB.

Intel® Core™ i3-330E Processor with 2.13GHz (BGA), 3MB L2 cache, 1066MT/s dual channel DDR3 SODIMM memory interface for up to 8GB.

DDR3-SODIMM memory module with 1 GB RAM (1066 MT/s)

DDR3-SODIMM memory module with 4 GB RAM (1066 MT/s)

standard heatspreader for high performance COM Express modul conga- BM57 with intergrated heat pipes. All stand- offs are M2.7 mm bore hole.

Intel GM45 and Intel Core2Duo T9400, CPU with 2.53 GHz, 6 MB L2-Cache and 1066 Mhz FSB

Intel GL40 and Intel Celeron M 575, CPU with 2.0 Ghz, 1 MB L2-Cache and 667 MHz FSB. No PEG-Port!

Thermal Stack Set (TSS) for COM Express Basic module conga-BM45/T9400. This set includes three thermal stacks: 1x for CPU, 1x for GMCH and 1x for IOCH. Attention: These thermal stacks may only be used to adapt the COM Express module on the customer specific cooling solution. The thermal stacks only are not adequate to cool the COM Express module. Recommended for horizontal use.

DDR3-SODIMM memory module with 2 GB RAM (1066 MT/s)

Intel Core 2 Duo 1.86GHz Penryn CPU SL9400, 6MB L2 cache, 1066MHz FSB.

Intel Core 2 Duo 1.2GHz Penryn CPU SU9300, 3MB L2 cache, 800MHz FSB.

Intel® Celeron® M Processor ULV 722 with 1.2GHz, 1MB L2 cache, 800MHz FSB.

Heatspreader for conga-BS45 Standoff with M2.5mm thread

DDR3-SODIMM memory module with 2 GB RAM (1066 MT/s)

Intel Core2Duo 1.85GHz Penryn CPU SL9400, 6MB L2 cache and 1066MHz FSB

Intel Celeron M Processor 723 with 1.2GHz, 1MB L2 cache and 800MHz FSB.

Heatspreader for COM-Express-Compact-Module conga-CS45 Standoff with 2.7mm bore hole.

Thermal Stack Set (TSS) for COM Express module conga-CS45. These thermal stacks may only be used to adapt the COM Express module to the customer specific cooling solution. The thermal stacks only are not adequate to cool the COM Express module. Recommended for horizontal use

DDR3-SODIMM memory module with 2 GB RAM (1066 MT/s)

AMD Ontario™ Dual Core Processor T56N with 1.6GHz, 1MB L2 cache and 1066MT/s DDR3 SODIMM memory interface for up to 8GB.

AMD Ontario™ Dual Core Processor T40N with 1.0GHz, 1MB L2 cache and 1066MT/s DDR3 SODIMM memory interface for up to 8GB.

AMD Ontario™ Single Core Processor T44R with 1.2GHz, 512kB L2 cache and 1066MT/s DDR3 SODIMM memory interface for up to 8GB.

COM Express Basic module with AMD Ontario™ Dual Core Processor T40E 1.0GHz, 1MByte L2 cache and 1066MT/s DDR3 SODIMM memory interface for up to 8GB

Standard heatspreader for COM Express Basic module conga-BAF. All stand-offs are M2.5mm threaded.

Standard passive cooling solution for module conga-BAF. All stand-offs are with 2.7mm bore hole

Standard active cooling solution for module conga-BAF. Integrated 12V fan. All stand-offs are with 2.7mm bore hole

DDR3-SODIMM memory module with 1 GB RAM (1066 MT/s)

Intel 945GM chipset and Intel Celeron M 423, ULV-CPU with 1.06 GHz, 1 MB L2-Cache and 533 Mhz FSB

Intel 945GM chipset and Intel CoreDuo L2400, CPU with 1.66 Ghz, 2 MB L2-Cache and 667 Mhz FSB

Intel 945GM chipset and Intel Celeron M 440, CPU with 1.86 GHz, 1 MB L2-Cache and 533 Mhz FSB

512 MByte DDR2 SODIMM memory module

2 GByte DDR2 SODIMM memory module

Heatspreader for conga-B945, Standoff with M2.5mm thread

Standard active cooling solution for COM Express modules conga-B945 BGA variant, surface black with 10mm fins, integrated 12V fan 5500rpm, cable length 200mm, w/3 pin, 2.54 pitch connector, thread standoffs

Standard passive cooling solution for COM Express modules conga-B945 BGA variant, surface black with 10mm fins, thread standoffs

512 MByte DDR2 SODIMM memory module

2 GByte DDR2 SODIMM memory module

Heatspreader for conga-B945 socket, Standoff with M2.5mm thread

Standard active cooling solution for COM Express modules conga-B945 socket variant, surface black with 10mm fins, integrated 12V fan 5500rpm, cable length 200mm, w/3 pin, 2.54 pitch connector, thread standoffs

Standard passive cooling solution for COM Express modules conga-B945 socket variant, surface black with 10mm fins, thread standoffs

Intel 945GME and Intel Atom N270 with 1.6GHz, 512kb L2-Cache and 533MHz FSB

Heatspreader for COM-Express-Basic-Module conga-BA945/N270 Standoff with 2.5mm thread

DDR2-SODIMM memory module with 512MB RAM (667 MT/s)

COM Express Compact Module (95 x 95mm) with Type II connector layout featuring Intel® Atom N270 (SC) 1.6GHz CPU, 512kB L2-Cache und 533MHz FSB, supports up to 2GB SO-DIMM DDR2 533MT/s PC2-4200 physical memory.

Standard heatspreader for COM Express Compact module conga-CA945. All stand-offs are M2.5mm threaded.

Standard passive cooling solution for COM-Express-Compact-Module conga-CA945 surface black with 10mm fins, thread standoffs

DDR2-SODIMM memory module with 1GB RAM (667 MT/s)

Intel 910GMLE chipset and Intel Celeron M with 600MHz, 512 kB L2-Cache and 400 Mhz FSB

Intel 910GMLE chipset and Intel Celeron M with 1.5GHz, 1 MByte L2-Cache and 400 Mhz FSB

Heatspreader for conga-B915, Standoff with M2.5mm thread

Standard active cooling solution for COM Express modules conga-B915 BGA variant, surface black with 10mm fins, integrated 12V fan 5500rpm, cable length 200mm, w/3 pin, 2.54 pitch connector, thread standoffs

Standard passive cooling solution for COM Express modules conga-B915 BGA variant, surface black with 10mm fins, thread standoffs

512 MByte DDR2 SODIMM memory module

Intel Atom E620 processor, 600MHz

Intel Atom E660 processor 1.3GHz

COM Express Compact module with Intel® Atom™ E660 processor 1.3GHz, 512kByteL2 cache and 2GByte DDR2 onboard memory. Based on Intel® Platform Controller Hub EG20

COM Express Compact module with Intel® Atom™ E620T processor 600MHz, 512kByteL2 cache and 1GByte DDR2 onboard memory. Based on Intel® Platform Controller Hub EG20T. Industrial grade temperature range from -40°C to 85°C

COM Express Compact module with Intel® Atom™ E660T processor 1.3GHz, 512kByteL2 cache and 1GByte DDR2 onboard memory. Based on Intel® Platform Controller Hub EG20T. Industrial grade temperature range from -40°C to 85°C

Standard heatspreader for COM Express Compact module conga-CA6. The four corner stand-offs are with 2.7mm bore hole. The center standoff is with 2.5mm metric thread

Intel Atom Z510 and Intel System controller Hub US15W, CPU with 1.1GHz, 512kB L2-Cache, 400MHz FSB and 512MB DDR2 400MT/s onboard memory

Intel Atom Z530 and Intel System controller Hub US15W, CPU with 1.1GHz, 512kB L2-Cache, 400MHz FSB and 512MB DDR2 400MT/s onboard memory. 2x PCI-Express x1 lanes, no PCI-Bus, no SATA, no GB LAN.

Intel Atom Z530 and Intel System controller Hub US15W, CPU with 1.6GHz, 512kB L2-Cache, 533MHz FSB and 1.0 GB DDR2 533MT/s onboard memory. 1x PCI-Express x1 lanes and GB LAN onboard.

Intel® Atom™ Z510 PT and Intel SCH US15WPT, CPU with 1.1 GHz, 512kb L2 Cache and 400 MHz FSB. No SSD onboard. No PCIe lane.

Intel Atom Z520 PT and Intel SCH US15WPT, CPU with 1.3 GHz, 512kB L2-Cache and 533MHz FSB. 2.0GB onboard SSD and 1x PCIe lane.

COM-Express-Compact-module with AMD Geode LX800 mit 500 Mhz, LVDS graphics-interface, GB-LAN

512 MByte DDR1 SODIMM memory module

Heatspreader for conga-CLX, Standoff with 2.7mm bore hole

Evaluation Carrier Board for COM Express Type6 Modules

Evaluation carrier board for COM-Express-modules.

High Definition Audio evaluation adapter for conga-CEVAL

SMART Battery Manager Module for COM Express

Starterkit to evaluate SBM-Features for COM Express with SMART-Battery Manager Module and cable set

LVDS to DVI converter board for digital flat panels with onboard EEPROM

ADD2 display adapter card with single DVI-D digital output. Suitable for all Intel based platforms that support Serial Digital Display Outputs (SDVO) on the standard x16 PCI Express Graphics (PEG) port.

Flatpanel prototype adapter to develop your own flatpanel adapter Including cables set.

AMD Ontario™ Dual Core Processor T56N with 1.6GHz, 1MB L2 cache

AMD Ontario™ Dual Core Processor T40N with 1.0GHz, 1MB L2 cache

AMD Ontario™ Single Core Processor T44R with 1.2GHz, 512kB L2 cache

Standard XTX module with AMD Ontario™ Dual Core Processor T40E 1.0GHz, 1MByte L2 cache and 1066MT/s DDR3 SODIMM memory interface for up to 4GB

conga-XAF. All stand-offs are M2.5mm threaded.

Standard passive cooling solution for modules conga-EAF and conga-XAF. All stand-offs are M2.5mm threaded

Standard active cooling solution for modules conga-EAF and conga-XAF. Integrated 12V fan. All stand-offs are M2.5mm threaded

DDR3-SODIMM memory module with 2 GB RAM (1066 MT/s)

Intel® GME965 chipset and Intel® Core™ 2 Duo 1.6 GHz LV, 4 MB L2-Cache, 800MHz FSB (Intel code L7500)

Intel® GLE960 chipset and Intel® Celeron M 2.0 GHz, 1 MB L2-Cache, 533MHz FSB (Intel code 550)

Intel 945GM chipset and Intel Celeron M 423, ULV-CPU with 1.06 GHz, 1 MB L2-Cache and 533 Mhz FSB

Intel 945GM chipset and Intel Core2Duo U7500, ULV-CPU with 1.06 GHz, 2 MB L2-Cache and 533 Mhz FSB

Intel 945GM chipset and Intel Core2Duo L7400, LV-CPU with 1.5 Ghz, 2 MB L2-Cache and 667 Mhz FSB

1 GByte DDR2 SODIMM memory module

Heatspreader for conga-X915 and conga-X945, Standoff with 2.7mm bore hole

Standard active cooling solution for XTX modules conga-X915/X945, surface black with 10mm fins, integrated 12V fan 5500rpm, cable length 200mm, w/3 pin, 2.54 pitch connector, bore hole standoffs

Standard passive cooling solution for XTX modules conga-X915/X945, surface black with 10mm fins, bore hole standoffs

Standard passive cooling solution for XTX-Module conga-X915 and conga-X945 surface black with 10mm vertical fins, bore hole standoffs

Intel® Atom N270 1.6GHz CPU, 512kB L2-Cache and 533 MHz FSB.

Standard heatspreader for the XTX module conga-XA945. All stand-offs are M2.5mm threaded.

Intel 910GM chipset and Intel Celeron M with 600MHz, 512 kB L2-Cache and 400 Mhz FSB

Intel 915GM chipset and Intel Pentium M 738, LV-CPU with 1.4 GHz, 2 MB L2-Cache and 400 Mhz FSB

Intel 915GM chipset and Intel Pentium M 745, CPU with 1.8 GHz, 2 MB L2-Cache and 400 Mhz FSB

1 GByte DDR2 SODIMM memory module

Heatspreader for conga-X915 and conga-X945, Standoff with 2.7mm bore hole

Standard active cooling solution for XTX modules conga-X915/X945, surface black with 10mm fins, integrated 12V fan 5500rpm, cable length 200mm, w/3 pin, 2.54 pitch connector, bore hole standoffs

Standard passive cooling solution for XTX modules conga-X915/X945, surface black with 10mm fins, bore hole standoffs

Standard passive cooling solution for XTX-Module conga-X915 and conga-X945 surface black with 10mm vertical fins, bore hole standoffs

Intel 852GM chipset and Intel Celeron M with 600MHz, 512kB L2-Cache and 400 Mhz FSB

256 MByte DDR1 SODIMM memory module

1 GByte DDR1 SODIMM memory module

Standard active cooling solution for XTX modules conga-X855/E855, surface black with 10mm fins, integrated 12V fan 5500rpm, cable length 200mm, w/3 pin, 2.54 pitch connector, thread standoffs

Standard passive cooling solution for XTX modules conga-X855/E855, surface black with 10mm fins, thread standoffs

Heatspreader for conga-E855 and conga-X855, Standoff with M2.5mm thread

Standard passive cooling solution for XTX-Module conga-X855 and ETX-Module conga-E855, surface black with 10mm vertical fins, thread standoffs

AMD Geode LX800 and AMD companion chip CS5536 mit 500 Mhz, LVDS graphics-interface

256 MByte DDR1 SODIMM memory module

1 GByte DDR1 SODIMM memory module

Heatspreader for conga-XLX, Standoff with M2.5mm thread

SMART Battery Manager Module

Starterkit to evaluate SBM-Features. With SMART-Battery Manager Module and cable set.

SMART Battery Manager Module Design Kit including licence agreement for custumer integration, Hardware design files (Schematics, Bill of Material), Battery Manager Firmware (incl. commented source code), AVR-Programming Tool AT90 JTAG ICE MKII

XTX-Starterkit with XEVAL, Xdebug, FPA2, XDVI, Power supply, USB-Stick with 128 MB, ... Without XTX-module

LVDS to DVI adapter board for digital fl at panels with a graphics resolution up to 1280x1024 pixel

Power cable for conga-LVDI LVDS to DVI adapter, dual row 2,54mm 10pin IDC receptacle, 10pin 1,27mm pitch ribbon cable, length 15cm

XTX debugging platform. Including cable for COM, PS/2 and VGA

Connector for ETX and XTX carrier boards, height 3.0 mm, packing unit 8 pieces

Thermal stack set for conga-E855, conga-X852, conga-X915 and conga-X945. Consists of 3 stacks for CPU, GMCH and IOCH

AMD Ontario™ Dual Core Processor T56N with 1.6GHz, 1MB L2 cache

AMD Ontario™ Dual Core Processor T40N with 1.0GHz, 1MB L2 cache

AMD Ontario™ Single Core Processor T44R with 1.2GHz, 512kB L2 cache

Standard ETX module with AMD Ontario™ Dual Core Processor T40E 1.0GHz, 1MByte L2 cache and 1066MT/s DDR3 SODIMM memory interface for up to 4GB

Standard heat spreader for XTX module conga-XAF. All stand-offs are M2.5mm threaded.

Standard passive cooling solution for modules conga-EAF and conga-XAF. All stand-offs are M2.5mm threaded

Standard active cooling solution for modules conga-EAF and conga-XAF. Integrated 12V fan. All stand-offs are M2.5mm threaded

DDR3-SODIMM memory module with 2 GB RAM (1066 MT/s)

Intel 852GM chipset and Intel Celeron M with 600MHz, 512kB L2-Cache and 400 Mhz FSB

Intel 855GME chipset and Intel Celeron M 370 CPU with 1.5 GHz, 512kb L2-Cache and 400 Mhz FSB

512 MByte DDR1 SODIMM memory module

Heatspreader for conga-E855 and conga-X855, Standoff with 2.7mm bore hole

Standard active cooling solution for XTX modules conga-X855/E855, surface black with 10mm fins, integrated 12V fan 5500rpm, cable length 200mm, w/3 pin, 2.54 pitch connector, bore hole standoffs

Standard passive cooling solution for XTX modules conga-X855/E855, surface black with 10mm fins, bore hole standoffs

Standard passive cooling solution for XTX-Module conga-X855 and ETX-Module conga-E855, surface black with 10mm vertical fins, bore hole standoffs

AMD Geode LX800 mit 500 Mhz, LVDS graphics-interface

256 MByte DDR1 SODIMM memory module

1 GByte DDR1 SODIMM memory module

AMD Geode LX 800, 128 MByte DRAM onboard, LVDS

AMD Geode LX 800, 256 MByte DRAM onboard, TTL

Evaluation carrier board for ETX-modules

Connector for ETX and XTX carrier boards, height 3.0 mm, packing unit 8 pieces