congatec AG and Seco Unveil New Form Factor for Next Generation Embedded Computing: Qseven
Nuremberg, Embedded World, February 26, 2008 * * * congatec AG and SECO S.r.l., leaders in advanced embedded technologies, have jointly created a new form factor for embedded computing.
This new standard is expected to enable state-of-the-art technology with long term availability, using the latest low power chipsets.
Targeting next generation embedded processors built using 45nm technology, the Qseven format will complement the low power and small size of these processors. By exploiting the small form factor of the industry’s latest processors, the Qseven format offers high performance computing power, delivered in a board measuring just 70mm x 70mm.
The Qseven platform has been developed with performance and flexibility in mind, allowing various processor configurations to maximize passive cooling technology. With a maximum power consumption of around 12W specified in the standard, the new form factor is expected to appeal to manufacturers of applications that require fanless operation. Where heat dissipation is an issue, a thermal cooling interface has been defined to help transfer any heat generated to a cooling solution.
It will also provide extensive connectivity through industry standard interfaces, including: 4x PCI Express; 2x SATA; 6x USB 2.0; 1x 1000BaseT Ethernet; 2x SDIO 8 Bit; LVDS 2x 24 Bit; DVO/SDVO (shared); VIP (Video Input Port); HDA (High Definition Audio); I²C Bus; LPC (Low Pin Count Bus).
The innovative form factor offers unparalleled flexibility in configuration. By leveraging the Mobile PCI Express Module (MXM) connector format, Qseven offers three different connector heights, from 4.3mm to 7.8mm. Through this configuration it is hoped the Qseven platform will be as simple to integrate as a DIMM memory module.
Typical applications will include Automation / DIN Rail Systems, Automotive, and anywhere an ultra mobile embedded computing system is required.
congatec AG and SECO are extending an invitation to all vendors to join its open consortium and plan to release a general specification by the end of April, with a full Design Guide available by May 2008.