Communiqués de presse
PICMG Consortium Releases New COM Express Design Guide
Version 1.0 of the design specification has been completed under the auspices of congatec AG
Deggendorf, Germany, April 15, 2009 * * * congatec AG, a leading supplier of embedded computer modules, announces the immediate availability of Version 1.0 of the COM Express Design Guide for developers of COM Express modules.
The Design Guide was revised by the PICMG (PCI Industrial Computer Manufacturers Group, Inc.) over the last 18 months with the active collaboration of 15 companies. In addition to draft editor congatec AG, the following companies were involved: Adlink, Continuous Computing, Diversified Technology, Foxconn, GE Fanuc, Intel Corp., Kontron AG, MSC Vertriebs GmbH, NMS Communications, Nokia Siemens Networks, RadiSys, Trenton Technology, Tyco Electronics and VIA.
The COM Express Design Guide provides information on how to design custom system carrier boards for COM Express modules. The vendor independent, 160-page Design Guide includes a multitude of circuit examples which illustrate the correct implementation of all COM Express interfaces. Carrier boards designed on the basis of this guide enable greater interchangeability between COM Express modules from different vendors.
The COM Express Design Guide is available for free download from the PICMG website at http://www.picmg.org/pdf/PICMG_COMDG_100.pdf.