Congatec AG
We simplify the use of embedded technology

Communiqués de presse

14. November 2006

64 Bit Dual Core COM Express Module

conga-B945/64: High Performance COM Express Board with 64 Bit Dual Core Technology

Deggendorf, November 14, 2006 – The new conga-B945/64 sets a new performance standard for COM Express embedded computer modules. It utilizes the new 64 Bit Intel Core 2 Duo processor T7400 and dual channel memory. The conga-B945/64 is been shown for the first time at the Electronica tradeshow in Munich.

The conga-B945/64 is equipped with a 2.16 GHz 64 Bit Intel Core 2 Duo processor. This CPU has 4 MByte L2 cache and can address up to 4 GByte DDR2 667 dual channel RAM. Using two memory modules doubles the bandwidth of the memory access.
As a result of the 64 Bit support offered by the Intel Core 2 Duo processor, the conga-B945/64 is highly flexible and can support both 64 Bit and 32 Bit applications as well as operating systems. Intel's virtualization technology allows multiple operating systems and applications to be executed simultaneously on independent CPU cores and partitions.
The processor is manufactured using a 65 nm process, which provides an excellent computing performance to power consumption ratio.
The conga-B945/64 utilizes the Intel® 945GM chipset. It features numerous interfaces and choices for expansions. The conga-B945/64 provides 5x PCI Express lanes, PCI Express graphics port (PEG 1x16), 8x USB 2.0, HDA digital audio, 2x serial ATA, signals for 2x ExpressCard and gigabit Ethernet. All congatec system extensions, such as ACPI battery management, multi stage watchdog timer, fast multimaster I²C bus and the congatec embedded BIOS features are implemented.
The Intel Media Accelerator 950 graphics controller is integrated in the chipset and is able to drive two independent graphic channels using 2x24 Bit LVDS, SDVO, TV-Out or analog VGA. Flat panel displays are automatically recognized and configured using EPI (Embedded Panel Interface).
The conga-B945/64 is available for mass production from April 2007.  Engineering samples are available now.