COM Express

Concept:

Compact, powerful and extremely wide scalable modular platform for Computers-on-Modules (COMs) based onX86 architecture.

Benefits:

  • Extreme scalability and flexibility
  • Widest market acceptance
  • Highest performance and bandwith of all COM standards
  • Multiple, mount and plug compatible form factors
  • Choice of different pinout types

Specifications:

Size:

  • 95x95 mm (Compact)
  • 95x125 mm (Basic)
  • 110x155 mm (Extended)

Power:

12V, max. TDP 188 W (Extended)

Connector:

2 pieces 0.5 mm pitch Free Height 220 pin

Consortium:

http://www.picmg.org/

Latest Standard:

https://www.picmg.org/product/com-express-module-base-specification/

COM Express Design Guide:

http://picmg.org//wp-content/uploads/PICMG_COMDG_2.0-RELEASED-2013-12-061.pdf

Typical Applications:

  • Industrial Automation
  • High End Digital Signage
  • High End POS/Kiosk
  • Medical
  • Test&Measurement
  • Entertainment
  • Transportation
  • Building Technology

Interfaces

Type 2Type 6
PCI Express68
PEG Port1 (muxed with SDVO)1
SDVO2 (muxed with SDVO)1 (muxed with first DDI)
DDI (Digital Display Interface)03
USB 2.084
USB 2.0&3.044
PCI Bus 32 Bit1-
IDE1-
Ethernet11
SATA44
LVDS11
VGA11
CAN-1
HDA (High Definition Audio)11
GPIO (General Purpose Input/Output)88
SDIO01 (Muxed with GPIO)
SM Bus11
I²C Bus11

 

COM Express Type 6 Reference Carrier Board