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COM Express

Concept:

Compact, powerful and extremely wide scalable modular platform for Computers-on-Modules (COMs) based onX86 architecture.

Benefits:

  • Extreme scalability and flexibility
  • Widest market acceptance
  • Highest performance and bandwith of all COM standards
  • Multiple, mount and plug compatible form factors
  • Choice of different pinout types

Specifications:

Size:

  • 95x95 mm (Compact)
  • 95x125 mm (Basic)
  • 110x155 mm (Extended)

Power:

12V, max. TDP 188 W (Extended)

Connector:

2 pieces 0.5 mm pitch Free Height 220 pin

Consortium:

http://www.picmg.org/

Latest Standard:

http://www.picmg.org/v2internal/specorderformsec.htm

COM Express Design Guide:

www.picmg.org/pdf/PICMG_COMDG_2.0-RELEASED-2013-12-06.pdf

Typical Applications:

  • Industrial Automation
  • High End Digital Signage
  • High End POS/Kiosk
  • Medical
  • Test&Measurement
  • Entertainment
  • Transportation
  • Building Technology

Interfaces

Type 2 Type 6
PCI Express 6 8
PEG Port 1 (muxed with SDVO) 1
SDVO 2 (muxed with SDVO) 1 (muxed with first DDI)
DDI (Digital Display Interface) 0 3
USB 2.0 8 4
USB 2.0&3.0 4 4
PCI Bus 32 Bit 1 -
IDE 1 -
Ethernet 1 1
SATA 4 4
LVDS 1 1
VGA 1 1
CAN - 1
HDA (High Definition Audio) 1 1
GPIO (General Purpose Input/Output) 8 8
SDIO 0 1 (Muxed with GPIO)
SM Bus 1 1
I²C Bus 1 1

 

COM Express Type 6 Reference Carrier Board