COM Express
Concept:
Compact, powerful and extremely wide scalable modular platform for Computers-on-Modules (COMs) based onX86 architecture.
Benefits:
- Extreme scalability and flexibility
- Widest market acceptance
- Highest performance and bandwith of all COM standards
- Multiple, mount and plug compatible form factors
- Choice of different pinout types
Specifications:
Size:
- 95x95 mm (Compact)
- 95x125 mm (Basic)
- 110x155 mm (Extended)
Power:
12V, max. TDP 188 W (Extended)
Connector:
2 pieces 0.5 mm pitch Free Height 220 pin
Consortium:
Latest Standard:
http://www.picmg.org/v2internal/specorderformsec.htm
COM Express Design Guide:
http://www.picmg.org/pdf/PICMG_COMDG_100b.pdf
Typical Applications:
- Industrial Automation
- High End Digital Signage
- High End POS/Kiosk
- Medical
- Test&Measurement
- Entertainment
- Transportation
- Building Technology
Interfaces
| Type 2 | Type 6 | |
|---|---|---|
| PCI Express | 6 | 8 |
| PEG Port | 1 (muxed with SDVO) | 1 |
| SDVO | 2 (muxed with SDVO) | 1 (muxed with first DDI) |
| DDI (Digital Display Interface) | 0 | 3 |
| USB 2.0 | 8 | 4 |
| USB 2.0&3.0 | 4 | 4 |
| PCI Bus 32 Bit | 1 | - |
| IDE | 1 | - |
| Ethernet | 1 | 1 |
| SATA | 4 | 4 |
| LVDS | 1 | 1 |
| VGA | 1 | 1 |
| CAN | - | 1 |
| HDA (High Definition Audio) | 1 | 1 |
| GPIO (General Purpose Input/Output) | 8 | 8 |
| SDIO | 0 | 1 (Muxed with GPIO) |
| SM Bus | 1 | 1 |
| I²C Bus | 1 | 1 |
