Press Releases

New VDC Research white paper with congatec and NXP: Standardized COMs with i.MX 95 processors drive industrial vision AI adoption amidst 48.3% edge AI growth

congatec to showcase application-ready embedded solution platforms at CIIF 2025 in Shanghai

congatec GmbH holds majority of JUMPtec GmbH, strengthens technology leadership and Computer-on-Module portfolio

New local manufacturing capacities strengthen congatec's global presence and address international trade disruptions

High-performance ecosystems for innovative solutions

Atlanta, USA / Deggendorf, Germany, March 11, 2025 * * * AMI®, the global leader in Dynamic Firmware for worldwide computing, and congatec, a leading provider of embedded and edge computing…

COMs just got even cooler

Unrivaled AI performance for COMs with Intel Core Ultra processors

Empowering smart factories: congatec highlights application-ready solution platforms

Application-ready software building blocks for simple and fast IoT connectivity

More AI and graphics performance for low-power SMARC modules

New performance boost for COMs with Intel Core S technology