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conga-QMX6

Qseven quad core ARM Module

  • Based on NXP i.MX6 ARM Cortex A9 processors
  • Extended temperature range (optional)
  • Low power dissipation
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Zusätzliche Ecosystem Parts

Cooling solutions

Add-On Cards

Carrierboards

Module services

Spezifikation

Formfactor
Qseven
CPU
NXP i.MX6 Solo ARM Cortex A9 (1 x 1.0 GHz, 512kB L2 cache, 3W)
NXP i.MX6 Dual ARM Cortex A9 (2 x 1.0 GHz, 1MB L2 cache, 3W)
NXP i.MX6 Quad ARM Cortex A9 (4 x 1.0 GHz, 1MB L2 cache, 3W)
NXP i.MX6 Dual Lite ARM Cortex A9 (2 x 1.0 GHz, 512kB L2 cache, 3W)
DRAM
Up to 4 GByte onboard DDR3L memory | 1066 MT/s
Ethernet
Gigabit Ethernet
I/O Interfaces
4 x USB 2.0
1 x SATA
1 x SDIO
1 x I²C bus
1 x CAN Bus
1 x PCIe 2.0
1 x USB OTG client
1 x SPI
Graphics
Integrated in NXP i.MX6 Series Video (VPU) | 2D Graphics (GPU2D) and 3D Graphics (GPU3D) | 3D graphics with 4 shaders up to 200MT/s dual stream 1080p/720p decoder/encoder. OpenGL | OpenCL and OpenVG 1.1
Operating Systems
Android
Windows Embedded Compact 7
Linux
BSPs with OS drivers and tools
Temperature

Operating: 0 to +60°C commercial grade | -40 t o +85°C industrial grade / Storage: -40 to +85°C
Humidity
Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.
Video Interfaces
1 x DDI
LVDS 2x24
Size
70 x 70 mm (2,75" x 2,75")

Dokumente

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Data Sheet

31.05.2022

Produktvarianten

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    conga-QMX6/DC-1G eMMC32 (P/N 016302)

    Qseven module with ultra low power NXP i.MX6 ARM Cortex-A9 1GHz Dual processor, 1MB L2 cache, 1GB onboard DDR3L memory and 32GB onboard eMMC. Commercial temperature range 0°C to 60°C.

    conga-QMX6/DCL-1G eMMC32 (P/N 016301)

    Qseven module with ultra low power NXP i.MX6 ARM Cortex-A9 1GHz Dual Lite processor, 512kB L2 cache, 1GB onboard DDR3L memory and 32GB onboard eMMC. Commercial temperature range 0°C to 60°C.

    conga-QMX6/QC-1G eMMC32 (P/N 016303)

    Qseven module with ultra low power NXP i.MX6 ARM Cortex-A9 1GHz Quad processor, 1MB L2 cache, 1GB onboard DDR3L memory and 32GB onboard eMMC. Commercial temperature range 0°C to 60°C.

    conga-QMX6/QC-2G eMMC32 (P/N 016304)

    Qseven module with ultra low power NXP i.MX6 ARM Cortex-A9 1GHz Quad processor, 1MB L2 cache, 2GB onboard DDR3L memory and 32GB onboard eMMC. Commercial temperature range 0°C to 60°C.

    conga-QMX6/SC-1G eMMC32 (P/N 016300)

    Qseven module with ultra low power NXP i.MX6 ARM Cortex-A9 1GHz Solo processor, 512kB L2 cache, 1GB onboard DDR3L memory and 32GB onboard eMMC. Commercial temperature range 0°C to 60°C.

    conga-QMX6/iDC-1G eMMC32 (P/N 016312)

    Qseven module with ultra low power NXP i.MX6 ARM Cortex-A9 800MHz Dual processor, 1MB L2 cache, 1GB onboard DDR3L memory and 32GB onboard eMMC. Industrial temperature range -40°C to 85°C

    conga-QMX6/iDCL-1G eMMC32 (P/N 016311)

    Qseven module with ultra low power NXP i.MX6 ARM Cortex-A9 800MHz Dual Lite processor, 512kB L2 cache, 1GB onboard DDR3L memory and 32GB onboard eMMC. Industrial temperature range -40°C to 85°C.

    conga-QMX6/iQC-1G eMMC32 (P/N 016313)

    Qseven module with ultra low power NXP i.MX6 ARM Cortex-A9 800MHz Quad processor, 1MB L2 cache, 1GB onboard DDR3L memory and 32GB onboard eMMC. Industrial temperature range -40°C to 85°C.

    conga-QMX6/iSC-1G eMMC32 (P/N 016310)

    Qseven module with ultra low power NXP i.MX6 ARM Cortex-A9 800MHz Solo processor, 512kB L2 cache, 1GB onboard DDR3L memory and 32GB onboard eMMC. Industrial temperature range -40°C to 85°C.

    Ecosystem Details

    Cooling solutions

    QMX6/HSP1-T (P/N 016160)

    Standard heatspreader with 1mm gap pad for Qseven module conga-QMX6 for processors with LIDDED FCBGA package.

    QMX6/HSP2-T (P/N 016161)

    Standard heatspreader with 2mm gap pad for Qseven module conga-QMX6 for processors with plastic MAP BGA package.

    QMX6/HSP3-T (P/N 016162)

    Standard heatspreader with heat stack solution for Qseven module conga-QMX6 for processors with open silicon FCBGA package.

    Add-On Cards

    conga-Qseven/MFG-Serial-Adapter (P/N 011127)

    MFG-header adapter on the QEV2 baseboard for RS-232 console-communication with UMX6 / QMX6.

    This adapter provides the ability to access the console in/output of the conga-QMX6 and mainly the conga-UMX6 product family (due to the fact that there isn't any console-connector on the conga-UMX6 module) via the MFG-header on the congatec part number 007005 conga-QEVAL/Qseven 2.0 ARM evaluation carrier board.

    Carrierboards

    conga-QEVAL/Qseven 2.0 ARM (P/N 007005)

    Evaluation carrier board for Qseven 2.0 modules based on ARM architecture.

    Module services

    Design-In Training (P/N 022214)

    Design-Training to develop carrier boards for Computer on Modules

    Conformal Coating Qseven, SMARC, Type 10 (P/N )

    HumiSeal® 1A33 coating for Qseven, SMARC and Type 10 modules; MIL-I-46058C qualified, IPC-CC-830 and RoHS
    Directive 2002/95/EC compliant and recognized under UL File Number E105698.

    Ext. temperature screening (-40°C to +85°C) (P/N )

    congatec Wide Temperature Range Screening
    Standard screening profile with 12h temperature screening and cold soak test
    Including functional test and several boot-ups (before & after screening)

    Ext. temperature screening (-25°C to +80°C) (P/N )

    congatec Wide Temperature Range Screening
    Standard screening profile with 12h temperature screening and cold soak test
    Including functional test and several boot-ups (before & after screening)

    Zubehör

    Mehr über conga-QEVAL/Qseven 2.0

    conga-QEVAL/Qseven 2.0

    To achieve a quick start with Qseven congatec offers an evaluation carrier board, which routes all the Qseven® signals to standard interface connectors.

    Mehr über conga-MCB/Qseven-ARM

    conga-MCB/Qseven-ARM

    The conga-MCB/ARM is a full featured carrier board for Qseven ARM modules.

    Mehr über conga-QKIT/ARM

    conga-QKIT/ARM

    This complete kit provides the ability to start evaluating Qseven® ARM modules immediately

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