Congatec AG
conga-TC175

conga-TC175

  • 7th Generation Intel® Core™ SOC processor
  • Intel® Gen9 HD Graphics with HEVC (H.265) support
  • Intel® Optane™ memory can be connected via PCI Express Gen 3.0
  • Low power consumption (TDP 15W, cTDP 7.5W)
  • Up to 32 GByte dual channel DDR4 memory

Spezifikation

Formfactor COM Express Compact
CPU Intel® Core™ i7-7600U (2 x 2.8 / 3.9 GHz, 4MB Cache, 15W)
Intel® Core™ i5-7300U (2 x 2.6 / 3.5 GHz, 3MB Cache, 15W)
Intel® Core™ i3-7100U (2 x 2.4 GHz, 3MB Cache, 15W)
Intel® Celeron® 3965U (2 x 2.2 GHz, 2MB Cache, 15W)
DRAM 2 Sockets, SO-DIMM DDR4 up to 2133 MT/s and 32 GByte dual channel
Chipset Integrated PCH-LP
Ethernet Intel® i219-LM GbE LAN Controller with AMT 11.6 support
I/O Interfaces 8 x PCI Express GEN 3.0 lanes
3 x Serial ATA® Gen 3 (can be configured as RAID)
4 x USB 3.0 (XHCI)
8 x USB 2.0 (XHCI)
LPC bus (no DMA)
I²C bus (fast mode, 400 kHz, multi-master)
2 x UART
Sound Digital High Definition Audio Interface with support for multiple audio codecs
Graphics Intel® Gen9 HD Graphics Engine
OpenCL 2.1, OpenGL 5.0 and DirectX12 (for Windows 10) support | up to three independent displays: HDMI 1.4a / DisplayPort 1.2 / eDP 1.3 | High performance hardware MPEG-2 decoding | WMV9 (VC-1) and H.265 (HEVC) support Blu-ray support @ 40 MBit/s | HEVC, VP9 and VDENC encoding
congatec Board Controller Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | LVDS backlight control I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control
embedded BIOS Features AMI AptioV® UEFI 2.x firmware
8/16 MByte serial SPI firmware flash
Security
The conga-TC175 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM 1.2 / 2.0). It is capable of calculating efficient hash and RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e commerce will benefit also with improved authentication, integrity and confidence levels.
Power Management ACPI 4.0 with battery support
Operating Systems Microsoft® Windows 10 (64bit only)
Fedora 24
Ubuntu
SuSe
Red Hat Enterprise
Yocto Project v2.2
Chromium 2
Wind River VxWorks
Microsoft® Windows 10 IoT Enterprise (64bit only)
Power Consumption See User's Guide for full details
Temperature Standard
Operating: 0 to +60°CStorage: -20 to +80°C
Humidity Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.
Video Interfaces 2x TMDS (HDMI) / DisplayPort 1.2 with support for Multi-Stream Transport (MST) | resolutions up to 4k | VGA (optional)
Dual channel LVDS transmitter, Supports flat panels 2x24 Bit interface | VESA and openLDI colour mappings | resolutions up to 1920x1200 Automatic Panel Detection via EDID/EPI
Size 95 x 95 mm (3,74" x 3,74")

Dokumente

Data Sheet

Manual

Image

Part Number

P/N Titel Beschreibung
045250 conga-TC175/i7-7600U COM Express Type 6 Compact module with Intel® Core™ i7-7600U dual core processor with 2.8GHz up to 3.9GHz, 4MB Intel® Smart Cache , GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U).
045251 conga-TC175/i5-7300U COM Express Type 6 Compact module with Intel® Core™ i5-7300U dual core processor with 2.6GHz up to 3.5GHz, 3MB Intel® Smart Cache , GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U)
045252 conga-TC175/i3-7100U COM Express Type 6 Compact module with Intel® Core™ i3-7100U dual core processor with 2.4GHz, 3MB Intel® Smart Cache , GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U)
045253 conga-TC175/3965U COM Express Type 6 Compact module with Intel® Celeron®  3955U dual core processor with 2.2GHz, 2MB Intel® Smart Cache, GT1 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U)
046951 conga-TC87/CSP-B
Standard passive cooling solution for COM Express modules conga-TC87, TC97 , TC170 and TC175.

All standoffs are with 2.7mm bore hole.
046952 conga-TC87/CSP-T
Standard passive cooling solution for COM Express modules conga-TC87, TC97 , TC170 and TC175.

All standoffs are M 2.5 threaded
046953 conga-TC87/HSP-B
Standard heatspreader for COM Express modules conga-TC87, TC97, TC170 and TC175.

All standoffs are with 2.7mm bore hole.
046954 conga-TC87/HSP-T
Standard heatspreader for COM Express modules conga-TC87, TC97 , TC170 and TC175.

All standoffs are M 2.5 threaded.
046955 conga-TC87/CSA-B
Standard active cooling solution for COM Express Compact modules conga-TC87, TC97 , TC170 and TC175 with 70mm radial FAN.

All stand-offs are with 2.7mm bore hole.
046956 conga-TC87/CSA-T
Standard active cooling solution for COM Express module conga-TC87, TC97 and TC175 with 70mm radial FAN.

All stand-offs are M2.5 threaded.
068790 DDR4-SODIMM-2400 (4GB) DDR4 SODIMM memory module with 2400 MT/s and 4GB RAM
068791 DDR4-SODIMM-2400 (8GB) DDR4 SODIMM memory module with 2400 MT/s and 8GB RAM
068792 DDR4-SODIMM-2400 (16GB) DDR4 SODIMM memory module with 2400 MT/s and 16GB RAM

Zubehör

conga-TEVAL

conga-TEVAL

Evaluation Carrier Board for COM Express® Type 6 Modules
conga-LDVI

conga-LDVI

DVI Converter Module for LVDS