Congatec AG

Embedded in your success.

[ Computer-on-Module | Single-Board-Computer | Customized Board ]

ESEC 2017

From May 10th to 12th, congatec will be at ESEC spring, the biggest IT show in Japan. It attracts over 1,495 exhibitors and 89,285 visitors for showcasing the latest embedded technology. You are invited to meet congatec at booth W4-20, West Hall, 1F, at Tokyo Big Sight. 

congatec will be showing a complete line of embedded computer modules, single board computers (SBCs) and embedded design and manufacturing services. 

For detailed information please download our ESEC 2017 Flyer

Highlights

  • Boards and modules based on the latest Intel processor (Kaby lake)
  • Industrial Ready-To-Use platform 
  • Power saving embedded modules 
  • Fast, energy efficient and high performance modules
  • Brand new SMARC 2.0 platform with USB Type-C 
  • COM Express 3.0 Type 7 –Real Time Hypervisor 

Products

conga-IC170 Thin Mini ITX Board

conga-IC175

Highest Performance Thin-Mini-ITX board based on 7th Generation Intel® Core™ Mobile SOC U-Processors

conga-TS175

COM Express Type 6 Basic module based on 7th Generation Intel® Core™ processor family

conga-SA5 SMARC module with Intel Apollo Lake processor

conga-SA5

SMARC 2.0 module based on 5th Generation Intel® Atom™ / Celeron® / Pentium® processors